2025 26th International Conference on Electronic Packaging Technology
The International Conference on Electronic Packaging Technology (ICEPT) is one of the largest and most cohesive packaging technology conference in Asia. ICEPT 2025 will be held by Shanghai University, IEEE Electronics Packaging Society (IEEE-EPS), and Electronic Manufacturing & Packaging Technology Society of Chinese Institute of Electronics (CIE-EMPT). Organized by National Center for Advanced Packaging (NCAP) , and Beijing Herogees Consulting Company, China.
This year's ICEPT will be held in Shanghai, China from August 5th to August 7th, 2025.