Advanced Semiconductor Packaging Techniques
The Department of Electrical, Electronics, and Communication Engineering (EECE) at GITAM School of Technology, Hyderabad, in association with the IEEE GITAM student branch chapter, hosted a distinguished guest lecture on ‘Advanced Semiconductor Packaging Techniques’ by Dr. Venkata Mokkapati, Global Director & Application Engineering at AT&S AG, Austria.
Dr. Mokkapati provided in-depth insights into cutting-edge semiconductor packaging technologies, including 2D, 2D+, 2.5D, 3D, 3.5D, and the latest 4D packaging, which integrates components through substrate folding or bending for enhanced electrical interconnectivity. He highlighted the demand for advanced build-up materials used in contemporary package structures such as BGA, CSP, and coreless packaging, emphasizing the critical factors of fine line and space, fine via pitch, low warpage during cure and reflow, and high insulation reliability.
Discussing the future of advanced packaging and IC substrates, Dr. Mokkapati elaborated on innovations such as D2 connection, larger body sizes, coefficient of thermal expansion (CTE) mismatch solutions, power delivery advancements, and improved thermal dissipation. He also addressed key developments in semiconductor technology, covering major technology blocks, top industry players, and the evolving AI value chain.
The lecture further delved into significant industry transformations, ABF substrate construction, high-performance computing (HPC) architecture, and the semiconductor chips driving future innovations. Dr. Mokkapati also shared insights on India’s emerging semiconductor manufacturing landscape, citing projects by leading companies such as Micron, Renesas, Stars, Kaynes Technology, TATA-PSMC, and Adani-Tower Semiconductor.
Engaging with the students, Dr. Mokkapati responded to queries from EECE students, fostering a dynamic exchange of knowledge and ideas. The event concluded with a felicitation ceremony led by Prof. T. Madhavi, Head of the EECE Department, and Prof. Prasantha R. Mudimela, the Convenor, who honored Dr. Mokkapati for his invaluable contributions.
Date and Time
Location
Hosts
Registration
-
Add Event to Calendar
- Rudraram, Patacheru mandal
- Sangareddy, Hyderabad
- Hyderabad, Andhra Pradesh
- India 502329
- Building: J
- Room Number: 303
Speakers
Mokkapati of AT & S
Advanced Semiconductor Packaging Techniques
Dr. Mokkapati will provide provided deep insights into cutting-edge semiconductor packaging technologies, spanning across 2D, 2D+, 2.5D, etc, which leverages substrate folding or bending to enhance electrical interconnectivity.
The session will be emphasized as given below
-
The growing need for advanced build-up materials in packaging formats like BGA, CSP, and coreless packages, highlighting requirements such as fine line and space resolution, minimal warpage during reflow, fine via pitch, and high insulation reliability.
-
Innovations shaping the future of IC substrates and packaging—including D2 connections, larger body sizes, solutions for CTE mismatch, power delivery enhancements, and thermal dissipation improvements.
-
A strategic overview of semiconductor technology building blocks, key industry players, and the rapidly evolving AI value chain.
Biography:
Dr. Venkata Mokkapati is currently Global Director, Business Development & Application Engineering at AT&S AG based in Austria. Venkata has more than 18 years of experience in Semiconductor industry and is a certified ICP engineer from Delft University of Technology from where he also holds a PhD. Prior to joining the industry in 2018 as Business Development Manager, Venkata has spent 12 years in academics and research in various universities/Institutes across Europe and Asia in inter-disciplinary fields of science. Venkata also has experience in establishing and running a sole trading company on graphene and other 2D materials. Venkata has authored and co-authored more than 40 peer-review journals/conference proceedings/patents. He was also the recipient of European Commission Marie Curie Co-Fund fellowship working on Ultrafiltration of body fluids using graphene and 2D based membranes. Currently he is also serving as Sub-committee member for AMT (Assembling and Manufacturing Technologies) in ECTC.
Email:
Address:Vienna, Austria
Media
| Raghu_AT_S_Austria_Guest_Lecture | 1.21 MiB |