Fundamentals of Signal Integrity for High-Speed Applications and Advances in Packaging Technology

#signal-integrity #system-performance #time-domain-analysis #vector-network-analyzer
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This talk will explore the fundamentals of signal integrity (SI) in high-speed applications, with a focus on both frequency- and time-domain analysis. Attendees will gain a foundational understanding of how signal loss, crosstalk, and reflections affect system performance at high data rates. The presentation will also highlight recent advances in packaging techniques for broadband applications, including chiplets and advanced interconnects, and how these innovations help address challenges in high-frequency design. This session aims to bridge the gap between SI fundamentals and modern packaging technologies, offering a comprehensive overview for engineers and students working on broadband systems.

At the end of the talk, the speaker will provide a summary of IEEE resources available to students and young professionals in the RF field.


  Date and Time

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  • 200 University Ave W
  • Waterloo, Ontario
  • Canada N2L 3G1
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  • Starts 28 July 2025 04:00 AM UTC
  • Ends 11 August 2025 04:00 PM UTC
  • No Admission Charge

  Speakers

Dr. Ahmed Abdelltif of Microchip

Biography:

Ahmed Abdellatif, Ph.D., SMIEEE is a Signal Integrity Engineer at Microchip, with expertise in high-speed SerDes for data center applications, advanced packaging technologies, and millimeter-wave antenna systems including beam-steering techniques. He holds a Ph.D. in Electrical and Computer Engineering from the University of Waterloo and brings over 15 years of industry experience at leading companies such as Mentor Graphics, Huawei, Semtech, and Peraso.

Ahmed actively contributes to the IEEE community through his roles on the IEEE MTT-S Student Engagement Subcommittee and the AP-S Wireless Communications Committee. He currently serves as Chair of the IEEE Ottawa AP-S/MTT-S Chapter, which has received three chapter awards under his leadership. Ahmed is also a recipient of the Best Interactive Paper Award at IEEE EPTC 2023.