U.S. members are eligible for a PDH certificate through watching this webinar.

As technologies push the limits of traditional silicon, the U.S. faces a critical challenge: how to continue delivering high-bandwidth, energy-efficient, multifunctional microelectronics essential for advanced technologies. Conventional 2D scaling is reaching physical and economic limits, and while industry is pursuing advanced packaging, the integration of mixed materials – beyond silicon – remains largely untapped. Yet this integration is essential for achieving the order-of-magnitude improvements that next-generation capabilities will require.

Join Michael Holmes from DARPA’s Microsystems Technology Office, to learn how DARPA’s Next Generation Microelectronics Manufacturing (NGMM) program is addressing this challenge. NGMM is establishing the nation’s first open-access center for U.S.-based 3D heterogeneous integration (3DHI) focused on mixed materials integration to leapfrog ahead of today’s state of the art. In partnership with The University of Texas at Austin and its Texas Institute for Electronics (TIE), NGMM is developing a sustainable domestic hub for R&D and pilot production, which will enable rapid prototyping and fabrication of advanced microsystems critical to future technological needs. Attendees will also learn about opportunities to engage with the NGMM community at the inaugural NGMM Summit this October in Austin, Texas.