Advances in Vertical Wire Technology for Wire Bond Applications

#wire #bonding #SiP #2.5D #3D

Advances in smart response-based processes have significantly improved wire bond reliability and further strengthened the use of the technology in high-volume manufacturing (HVM). Wire bonding technology remains a staple choice in vast majority of semiconductor packages due to its low cost, increased flexibility, and high yield rate. A traditional wire bond process consists of a wire loop with a ball bond on die and a wedge bond on substrate. Vertical Wires are an emerging interconnect solution formed using a unique process on the same ball bond equipment. Vertical Wires can be used as an alternative to the traditional wire bond processes or in conjunction with the traditional wire loops in SiPs. Although initially developed for interconnection applications, Vertical Wire technology was introduced in HVM for EMI shielding in SiP and RF packages. This presentation will detail new advances in Vertical Wire Technology to further reduce wire pitch, increase I/O density, and reduce package footprint. An overview of application range, capability and design rules for the technology will be discussed.