IEEE Symposium on Reliability for Electronics and Photonics Packaging

#reliability #silicon #photonics #electronics #packaging
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Reliability, Failure Modes, Testing for Integration of Electronics and Photonics

This symposium will focus on quantified reliability, accelerated testing and probabilistic assessments of the useful lifetime of electronic, photonic, MEMS and MOEMS materials, assemblies, packages and systems in electronics and photonics packaging.  This includes failure modes, mechanisms, testing schemes, accelerated testing, stress levels, and environmental stresses. Registration is now open.

Visit our website for details, for our Advance Program, and to register. https://attend.ieee.org/repp. 


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  • Milpitas, California
  • United States
  • Contact Event Host
  • Starts 04 August 2025 07:00 AM UTC
  • Ends 21 November 2025 09:00 PM UTC
  • Admission fee ?
  • Menu: Standard, Vegetarian