Characterization and Application of a New Chip-Level Air Pump

#MEMS #micro-cooling #air #cooling
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-- thermal management, air movement, µCooling, MEMS ...

Trends in consumer goods are leaning towards thinner, more compact products with higher performance than their predecessors. Today’s consumer wants lightweight, portable, battery-operated gear that is powerful enough to satisfy their needs for speed and ease of use. One of the biggest challenges facing product design is thermal management. Case temperature limits for products that come in contact with user’s skin place constraints on internal power dissipation and increase the need for improved thermal management. With the introduction of locally processed AI and higher compact portable device processing loads thermal issues are critical for avoiding throttling.
µCooling: A new device has been invented that changes the way thermal engineers are approaching system cooling design. µCooling is a new concept in air movers. It is small, and thin and is a complete departure from rotating mass fans. This MEMS-based invention can move air through very small spaces, used directly on a chip or package, placed remotely through tiny ducts, or mounted outside of a product. In fact, the versatility of µCooling changes the way we can manage heat at the package, SoC, or bare-chip level. This talk will introduce µCooling, a MEMS-based, all-silicon, micro-sized air pump. The device will be described in terms of how it works, performance characteristics, and application examples.


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  • Starts 09 September 2025 07:00 AM UTC
  • Ends 04 December 2025 09:00 PM UTC
  • No Admission Charge

  Speakers

Tom Tarter

Biography:

Thomas S. Tarter is a distinguished expert in IC packaging and thermal management, currently serving as Principal MTS Thermal Engineer at xMEMS Labs in Santa Clara, California. With over 40 years of experience in heat transfer, interconnect, and semiconductor packaging he has played a pivotal role in advancing package development, design, analysis, assembly, and manufacturing. His career includes 17 years at AMD as a Senior Member of the Technical Staff, followed by leadership roles as Director of BGA Package Engineering and Design at Advanced Interconnect Technology and Principal Engineer at NeoPhotonics Corporation, where he specialized in thermal management, temperature control, and package development of silicon-based waveguides for communications. 
In 2008, Tom founded Package Science Services LLC, providing high-tech industries with expertise in electronic packaging design, analysis, and characterization. After a decade managing the business, he joined Exo Imaging as Principal Thermal Engineer, focusing on ultrasound medical equipment. In 2024, he began work on µCooling at xMEMS, further advancing innovations in thermal engineering. Tom has authored over 30 technical papers, holds multiple patents, and has delivered numerous lectures and short courses worldwide. A respected leader in the field, he is a past General Chair of SEMI-THERM and continues to serve on its executive committee. Additionally, he is a Senior Member of IEEE and a former Chair of the IEEE Santa Clara Valley Chapter of CPMT/EPS.

Address:Santa Clara, California, United States