The Evolution of mmWave Antenna in Package Toward a Connected Intelligent Future

#communication #frequency #high-frequency
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This lecture presents the latest innovations in mmWave antenna-in-package (AiP) technologies as a key enabler of high-performance wireless communication and sensing systems. It covers advancements in high-frequency packaging substrates for compact multi-layer AiP integration, along with signal and power integrity challenges and solutions.  The lecture also includes heterogeneous integration approaches, measurement methodologies and results, as well as an introduction to the emerging Antennas-to-AI platform concept.


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  • 800 W Campbell Rd
  • Richardson, Texas
  • United States 75080-3021
  • Building: ECSN
  • Room Number: Osborn Conference Room
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The Evolution of mmWave Antenna in Package Toward a Connected Intelligent Future

This lecture presents the latest innovations in mmWave antenna-in-package (AiP) technologies as a key enabler of high-performance wireless communication and sensing systems. It covers advancements in high-frequency packaging substrates for compact multi-layer AiP integration, along with signal and power integrity challenges and solutions.  The lecture also includes heterogeneous integration approaches, measurement methodologies and results, as well as an introduction to the emerging Antennas-to-AI platform concept.

Address:United States