Dr. Sakuma-san of IBM Research

This talk traces a research journey centered on semiconductor packaging and 3D integration, with a unique detour into wearable sensing for healthcare. The first part of this talk introduces the development of a fingernail-mounted sensor for monitoring human health. It then shifts focus to the broader field of semiconductor packaging, highlighting recent advances in chiplet architectures, heterogeneous integration, and 3D assembly. Together, these topics illustrate how creativity and engineering challenges across different domains continue to shape the future of technology.

Biography:

Katsuyuki Sakuma is a Principal Research Staff Member, a Research Manager, and an IBM Master Inventor at the IBM T. J. Watson Research Center. He is also a Visiting Professor in the Department of Biomedical Engineering, Tohoku University, Japan, and previously at National Chiao Tung University, Taiwan. His research interests include 3D integration technologies, bonding technologies, advanced packaging, and biomedical engineering.

He has published more than 110 peer-reviewed journal papers and conference proceeding papers, including five book chapters. He also holds more than 100 issued or pending U.S. and international patents. He has been recognized with the IBM 20th Invention Achievement Award in 2022 and an Outstanding Technical Achievement Award (OTAA) in 2015. He was also given the 2018 Exceptional Technical Achievement Award from IEEE Electronics Packaging Society and the 2017 Alumni Achievement Award from his Alma Mater, the School of Engineering at Tohoku University, for his exceptional contribution to 3D chip stack technology development in the global microelectronics packaging industry. He was co-recipient of IEEE CPMT Japan Society Best Presentation Award in 2012, and the IMAPS Best Paper Award of the interactive poster session in 2015.

He received his B.S. and M.S. degrees from Tohoku University, respectively, and the Ph.D. degree from Waseda University, Japan. He has been a senior member of IEEE and a member of the Japan Society of Applied Physics (JSAP). He has served as a committee member of the IEEE ECTC sub-committee since 2012, for the IEEE 3DIC technical program committee since 2016, and for the IEEE IRPS since 2017.