Compact Low-Power mm-wave ICs for Next-Generation (5G/6G) Wireless Transceivers
Compact Low-Power mm-wave ICs for Next-Generation (5G/6G) Wireless Transceivers
Ultra-scaled active devices in both CMOS and BiCMOS technologies have reached outstanding fT/fmax, enabling an ever-increasing number of future emerging applications in the microwave/mm-wave frequency range, for the next-generation (5G/6G) wireless transceivers for communication, sensing and imaging applications.
This lecture addresses some fundamental and most severe design challenges for low-power mm-wave ICs, and advanced design methodologies that can mitigate the performance degradation and allow getting the largest potential out of the ultra-scaled technologies. It reports the design of innovative building-blocks as key enabling solutions for compact low-power mm-wave array ICs for next-generation (5G/6G) wireless transceivers.
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- 46 Avenue Felix Viallet
- Grenoble, Rhooe-Alpes
- France 38000
- Building: Amphithéâtre
- Room Number: C
Speakers
Dr. Zito of AGH University of Science and Technology, Krakow, Poland
Biography:
Domenico Zito (Senior Member, IEEE) received the M.Sc. degree in electronic engineering and the Ph.D. degree in information engineering from the University of Pisa, Pisa, Italy, in 2000 and 2004, respectively. He is currently a professor in electrical and computer engineering with Aarhus University, Arhus, Denmark. He has authored over 150 articles in peer-reviewed international journals and conference proceedings, nine books, and book chapters. He holds three patents. His current research interests include the design of microwave and mm-wave wireless transceivers for emerging data communication, noncontact sensing, and imaging applications. Dr. Zito has served as a TPC Member of the European Solid-State Circuits Conference. He received the Mario Boella (VP URSI) Prize for Research and Innovation in Wireless Technology in Europe in 2005. He was a recipient of the Start-Up Laboratory of the Year at the Irish Laboratory Awards in 2014, the IEEE Education Society Award for his Distinguished Contributions and Leadership in Engineering Education in 2015, and three best paper awards at the IEEE conferences. He has served as the TPC Chair of the IEEE International Conference on Electronics, Circuits and Systems 2016 and a Guest Editor and an Associate Editor for the IEEE Transactions on Circuits and Systems I: Regular Papers.