Inside Industry: Student Factory Tour
IEEE EPS MALAYSIA in collaboration with NXP hosted 2 lecturers and 19 students from Monash universities of Malaysia for an exclusive educational visit to its semiconductor packaging facility in Petaling Jaya.
The group was given a guided tour of several production lines, including ball grid array, leaded packages, flip-chip, and System-in-Package (SiP) technologies. Students had the opportunity to observe real-time manufacturing processes, interact with NXP engineers, and gain insights into the complexities of modern semiconductor packaging.
This visit is part of IEEE EPS MALAYISIA ongoing commitment to fostering industry-academia collaboration and inspiring the next generation of engineers. The engagement provided students with a valuable glimpse into the practical applications of their studies and the future of electronics innovation.
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