Advanced Packaging Workshop 2025 Penang
On October 15, 2025, the IEEE Electronics Packaging Society (EPS) Malaysia Chapter hosted Advanced Packaging Workshop at G Hotel, Penang, drawing strong participation from both industry and academia.
Dr. Beth Keser, delivered a comprehensive session on “Introduction to and Advances in 2.3D Fan-Out Wafer & Panel Level Packaging”, highlighting the latest innovations and trends in high-density integration and market benchmark.
Dr. Lee Teck Kheng, who presented on “Reliability Management”, sharing best practices and methodologies for ensuring long-term performance and robustness in advanced semiconductor packages.
The workshop attracted 87 participants, including professionals from leading companies such as Intel, TF-AMD, QDOS, Indium, and many others. The presence of students from universities like USM, UniMAP, and other institutions added a vibrant academic dimension to the event, fostering meaningful interaction between future engineers and seasoned industry experts.
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