Panel Session：How AI can help in Packaging
IEEE EPS Malaysia organized two insightful panel sessions titled “How AI Can Help in Packaging”, held in Penang and Bangi, moderated by KC Tan,discussions focused on AI applications in process control, defect detection, and material optimization.
Panelists includes Prof. Cheong Kuan Yew (Materials Scientist),Dr. Beth Keser (Advanced Packaging),Dr. Lee Teck Kheng (Interconnect Specialist),Dr. Eu Poh Leng (Senior Director, Package Development),Mr. Hee Wei Ken (Dispensing Expert)
Topics covered included model training challenges, failure prediction, and the view that AI is a tool—not a solution for every problem, with reflections on its impact on engineering roles.
Both sessions drew strong participation from industry and academia, reinforcing IEEE EPS Malaysia’s role in driving dialogue on smart packaging technologies.
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