Micro and Nanoscale Additive Manufacturing for Electronics Packaging Applications

#Topic: #nanoscale #nanotechnology
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Abstract

The Nanoscale Design and Manufacturing Laboratory (NDML) at the University of Texas at Austin focuses on the design and development of novel processes and equipment for the manufacturing of micro and nanoscale devices and structures. This talk will focus on two new microscale additive manufacturing processes, known as Holographic Metasurface Nano Lithography (HMNL) and Microscale Selective Laser Sintering (μ-SLS), that has been developed in the NDML for the fabrication of 3D electronic interconnect structures. In the HMNL process, sub-wavelength patterned metasurface masks (metamasks) are used to create multi-colored holograms in a photocurable metal-polymer hybrid resin. This process allows entire 3D, multi-material (insulators and conductors) nanostructures to be patterned using a single light exposure. Preliminary volumetric patterning using this method shows a build rate of over 20 mm 3 /s in both metals and polymers with sub-micron resolution making it ideal for fabricating redistribution layers for chip packaging applications. In the μ-SLS process, a thin layer of nanoparticle ink is first spread onto the substrate. The substrate is then positioned under an optical subsystem using a custom-built nanopositioning device. A laser that has been focused off a micromirror array is then used to sinter the nanoparticles together in a desired pattern with micrometer resolution. Another layer is then coated onto the substrate and the process is repeated to build up the 3D structure. Finally, the unsintered nanoparticles are washed away to reveal the final 3D part which is well suited for making microelectronic bump structures. This talk will present the materials science, mechatronic systems, optics designs, and process modeling used in both processes to make these additive manufacturing process capable of achieving micrometer resolution with high throughput over large areas (~ 50 mm x 50 mm) and thus break the conventional tradeoff between resolution and throughput in microscale metal 3D printing. 



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  • Dr. Bettermann, Chair IEEE Region 2 Susquehanna Section Nano Chapter CH02177 

    bettermann@ieee.org

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  • Co-sponsored by IEEE EDS (Electron Devices Society) https://eds.ieee.org/education/webinars/register


  Speakers

Michael Cullinan of Walker Department of Mechanical Engineering the University of Texas at Austin

Topic:

Micro and Nanoscale Additive Manufacturing for Electronics Packaging Applications

An adequate modeling of the self-organized quantum rings is possible only on the basis of the modern characterization of those nanostructures. We discuss an atomic-scale analysis of the indium distribution of self-organized InGaAs quantum rings (QRs). The analysis of the shape, size and composition of self-organized InGaAs QRs at the atomic scale reveals that AFM only shows the material coming out of the QDs during the QR formation. The remaining QD material, as observed by Cross-Sectional Scanning Tunneling Microscopy (X-STM), shows an asymmetric indium-rich crater-like shape with a depression rather than an opening at the center and determines the observed ring-like electronic properties of QR structures. A theoretical model of the geometry and materials properties of the self-organized

QRs is developed on that basis and the magnetization is calculated as a function of the applied magnetic field. Although the real QR shape differs strongly from an idealized circular-symmetric open-ring structure, Aharonov-Bohm-type oscillations in the magnetization have been predicted to survive. They have been observed using the torsion magnetometry on InGaAs QRs. Large magnetic moments of QRs are shown to originate from dissipationless circulating currents in the ground state of an electron or hole in the QR.

 

Biography:

Biography:
Dr. Cullinan is the director of the Semiconductor Science and Engineering program as well as an
Associate Professor in the Walker Department of Mechanical Engineering the University of Texas at Austin. Dr. Cullinan’s research focuses on the development of novel nanomanufacturing systems and on finding ways to exploit nanoscale physical phenomena in order to improve existing macroscale devices and to create novel micro- and nanoscale devices for energy and sensing applications. His research interests include the design and development of nanomanufacturing processes and equipment, metrology of micro and nanomanufacturing, the application of nanoscale science in engineering, the engineering of thin films, nanotubes and nanowires, the manufacturing and assembly of nanostructured materials, and the design of micro/nanoscale machine elements for mechanical sensors and energy systems. Dr. Cullinan has received many awards for his research and teaching including the Outstanding Young Manufacturing Engineer Award from the Society of Manufacturing Engineers (2016), the Rising Star Award from the Sensors Expo and conference (2017), American Society for Precision Engineering Early Career Award (2021), ASME Kornel F. Ehmann Manufacturing Medal (2020), multiple Best Poster Awards from the American Society for Precision Engineering (2017, 2018), and the Outstanding Teaching by an Assistant Professor Award from the Department of Mechanical Engineering at the University of Texas at Austin (2017). Dr. Cullinan is also an associate editor for both Precision Engineering and the ASME Journal of
Micro and Nanomanufacturing. In addition, he is the chair of the Micro and Nanotechnology Technical Leadership Committee for the American Society for Precision Engineering. Overall, Dr. Cullinan has published over 150 peer-reviewed journal papers, conference proceedings, book chapters, patents, and technical reports.

 

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Address:Austin, United States





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