Digital Twin Technology for Microelectronics Reliability

#condition-monitoring #digital-twin #estimation #microelectronics #methods #prognostics-and-health-management #temperature #electronics #packaging #reliability
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Digital Twin Technology for Microelectronics Reliability


Electronic components are getting increasingly integrated into mission-critical applications and are exposed to harsh environmental conditions (e.g., elevated temperatures). New methods of reliability estimation focus on product-specific condition monitoring and component health assessment. Prognostics and Health Management (PHM) using the Digital Twin-based framework is a promising way to achieve this. This webinar delves into several aspects of a Digital Twin and showcases a systematic procedure to prepare a continuously updated Digital Twin ‘Instance’ with a six-parameter material model reflecting thermo-oxidative ageing of Epoxy Moulding Compounds (EMC) and its effects on the thermomechanical behaviour of an electronic package.



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  • Webinar organized by IEEE EPS Germany Chapter



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Adwait of TU Delft

Topic:

Digital Twin Technology for Microelectronics Reliability

Electronic components are getting increasingly integrated into mission-critical applications and are exposed to harsh environmental conditions (e.g., elevated temperatures). New methods of reliability estimation focus on product-specific condition monitoring and component health assessment. Prognostics and Health Management (PHM) using the Digital Twin-based framework is a promising way to achieve this. This webinar delves into several aspects of a Digital Twin and showcases a systematic procedure to prepare a continuously updated Digital Twin ‘Instance’ with a six-parameter material model reflecting thermo-oxidative ageing of Epoxy Moulding Compounds (EMC) and its effects on the thermomechanical behaviour of an electronic package.

Biography:

Adwait Inamdar, PhD has a bachelor’s degree in mechanical engineering from Visvesvaraya National Institute of Technology Nagpur (India) and a M.Sc. in Computational Engineering from Ruhr-University Bochum (Germany). He recently obtained a PhD at the department of Microelectronics, TU Delft (The Netherlands). As a part of the multidisciplinary research group, ECTM (i.e., Electronic Components, Technology, and Materials), he has been working in the field of reliability engineering applied to semiconductor packaging and electronics-enabled systems, with a focus on physics-of-degradation modelling, Finite Element simulations, and Digital Twin technology for prognostics and health management of microelectronics.

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Address:Germany





Agenda

05:00 PM Introduction - A. Prisacaru

05:05 PM Digital Twin Technology for Microelectronics Reliability - Dr. Adwait Inamdar

05:45 Q&A



Webinar by IEEE EPS Germany Chapter