Dr. Dongkai Shangguan IEEE EPS Lecture

#Thermal #Thermal-management #TTC #TTV
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As power density in HPC and AI chips increases, effective thermal management becomes essential to maintain performance and reliability. Thermal Test Chips (TTCs) and Thermal Test Vehicles (TTVs) enable accurate emulation and measurement of chip thermal behavior across various sizes and configurations. With configurable power distribution and high-resolution temperature sensing, these tools allow early thermal design optimization and material evaluation. TTC- and TTV-based platforms are thus vital for developing advanced cooling solutions in modern semiconductor packaging.

 

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  • No. 101, Section 2, Guangfu Road, East District, Hsinchu City, Taiwan
  • Hsinchu, T'ai-wan
  • Taiwan 300
  • Building: Engineering Building I
  • Room Number: Lecture Hall R107
  • Click here for Map
  • Contact Event Host

  • pme@pme.nthu.edu.tw

  • Co-sponsored by National Tsing Hua University, NTHU Department of Power Mechanical Engineering
  • Starts 18 November 2025 04:00 PM UTC
  • Ends 24 November 2025 04:00 PM UTC
  • No Admission Charge

  Speakers

Dr. Dongkai Shangguan of Thermal Engineering Associates, Inc.

Topic:

Thermal Test Chips for Semiconductor Thermal Characterization

      Thermal management is becoming an ever more critical challenge for HPC and AI chips as the power density 
increases. Heat dissipation is often a great concern as the junction temperature rise can adversely affect the performance 
and reliability of the chip. For heterogenous integration with multiple chips of various functionalities, sizes, and power 
distributions all in the same package, the characterization of the thermal behavior becomes even more challenging. 
Effective tools and capabilities are needed to develop thermal management solutions to safeguard the performance of 
the semiconductor device. 
       Thermal Test Chips (TTC) and Thermal Test Vehicles (TTV) are great tools for thermal characterization. Versatile, 
configurable and accurate TTC’s can serve as reliable thermal utility chiplets to emulate the thermal behavior of 
semiconductor chips, from chiplets as small as 1mm2, to large chips and interposers (up to 50mm x 50mm, or larger if 
needed). This presentation will review the TTC technology with configurable power distribution and in situ temperature 
measurement on the chip - down to 1mm2 spatial resolution. TTV’s can be configured with multiple TTC’s in the same 
module to simulate the package architecture for various applications. Several use cases will be discussed to illustrate 
recent applications such as HPC and AI devices.  
        TTC’s and TTV’s can enable concurrent development of thermal management solutions while a new chip is under 
development, by providing the early-stage thermal design directions. TTV’s can also enable accurate characterization 
and evaluation of various thermal interface materials and cooling modules, in realistic packaging configurations. As 
such, Si TTC based TTV’s are essential tools for semiconductor thermal management.