IEEE Virtual YP Seminar: The Evolution of mmWave Antenna-in-Package Toward a Connected Intelligent Future
This lecture presents the latest innovations in mmWave antenna-in-package (AiP) technologies as a key enabler of high-performance wireless communication and sensing systems. It covers advancements in high-frequency packaging substrates for compact multi-layer AiP integration, along with signal and power integrity challenges and solutions. The lecture also includes heterogeneous integration approaches, measurement methodologies and results, as well as an introduction to the emerging Antennas-to-AI platform concept.
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- Starts 22 December 2025 02:00 PM UTC
- Ends 28 January 2026 03:00 PM UTC
- No Admission Charge
Speakers
Atom O. Watanabe is currently a Staff Research Scientist at the IBM T.J. Watson Research Center. His current research interests and expertise include modeling and design, signal/power integrity analysis, and hardware characterization for millimeter-wave packages, co-packaged optics, chiplet-based high-performance computers, and quantum computers. He received the Ph.D. in electrical and computer engineering from Georgia Institute of Technology. This talk is supported by MTT-S YP Outstanding Lecturer Series and MTT-S Speakers Bureau Program.