CIR & CIS: Agentic AI: Shaping the Future of Responsible and Generative Intelligence

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Agentic AI: Shaping the Future of Responsible and Generative Intelligence
 
Abstract: Artificial Intelligence is entering a new phase defined by systems that can learn, adapt, and collaborate with minimal human input. Agentic AI combines autonomy, generative models, and ethical design to build intelligent systems that act responsibly while learning from their environment. This transformation introduces greater transparency, reliability, and trust into automation. Going beyond conventional AI, Agentic systems reason across complex contexts and make explainable, human-aligned decisions. They merge Large Language Models (LLMs), federated learning, and explainable AI to deliver secure, privacy-preserving intelligence across healthcare, insurance, and enterprise domains. This talk explores practical applications, ethical challenges, and IEEE’s role in advancing trustworthy autonomy for the future. By fostering responsible and generative intelligence, Agentic AI paves the way for a more transparent, adaptive, and human-centric technological ecosystem.

  Date and Time

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  • 2155 E Wesley Ave
  • Denver, Colorado
  • United States 80208
  • Room Number: ECS 300
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  • Starts 02 February 2026 07:00 AM UTC
  • Ends 18 February 2026 07:00 AM UTC
  • No Admission Charge

  Speakers

David Bondurant

Topic:

3D Memory, 3D Packaging: What Next?

Abstract: “If we make them smaller, we can make them faster” has been the approach to building faster computers over the last 70-years starting with the first transistors and continuing as we built increasingly more complex integrated circuits. More recently we have gone Beyond Moore’s Law to fabricate advanced supercomputers and AI computers using 3D Memory and 3D Packaging. In this talk, I review recent trends in 3D Memory and 3D Packaging which are driving these high performance system towards wafer scale systems with multiple reticle sized processors and 3D memories. We observe the next generation HBM4, high bandwidth 3D DRAM, and the emergence of the HBF, high bandwidth Flash memory, to increase memory capacity to serve larger databases.

Biography:

David Bondurant holds a BS Physics from Truman State, BSEE from Missouri S &T, and an MBA in Technology Management from University of Phoenix. Mr Bondurant has been involved with the computer and semiconductor industry for 54-years. David has been a computer architect at Control Data, Sperry-Univac, and Honeywell and with the VHSIC (Very High Speed Integrated Circuits) at Univac & Honeywell where he developed microprocessor and ASIC semiconductor products in bipolar CML, CMOS, and radiation hard CMOS. Havid has also contributed to emerging non-volatile RAM marketing at industry leading companies, Ramtron (FRAM), Enhanced Memory Systems (EDRAM, ESRAM), Simtek (non-volatile SRAM), and Freescale Semiconductor/Everspin Technologies (MRAM). David Bondurant been involved with 5 successful start-up companies. Honeywell Digital Product Center provided ASIC components for Honeywell DPS-8 and Honeywell Bull DPS-7 mainframes systems and ETA Systems ETA-10 Supercomputer (the fastest computer in 1988). Enhanced Memory Systems delivered L2 Cache chips for HP PA-RISC microprocessor. Ramtron & Simtek continue to deliver FRAM and nvSRAM as part of Infineon Technology product line. Everspin Technologies is currently the leader in MRAM products worldwide. David is Distinguished Contributor of the IEEE Computer Society and is currently a candidate for Director-Elect of IEEE Region 5. 

Address:Colorado, United States