Modeling Polymers in Microelectronics - From Material Behavior to System Reliability

#microelectronics #mechanical #materials #delamination #laminates
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Modeling Polymers in Microelectronics

Polymeric materials play a decisive role in the performance and lifetime of modern microelectronic systems. From PCB or IC substrate laminates and encapsulation compounds to adhesives and functional layers, their thermo-hygro-mechanical behavior strongly influences stress evolution, warpage, delamination, and functional stability under service conditions. Modeling polymers in microelectronics, therefore, requires application-specific characterization combined with physics-based and multi-scale simulation approaches.

▸Based on advanced experimental methods, material models are calibrated to describe flow, curing, thermo-(hygro-)mechanical, and degradation behavior.
▸By linking global homogenized PCB models with detailed local sub-models, critical features can be assessed efficiently while maintaining computational feasibility.
▸Modeling polymers in microelectronics is a key enabler for physics-of-degradation understanding, reliability-driven design optimization, and the development of robust, next-generation electronic systems.

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  • This is a webinar organized by IEEE EPS Germany chapter


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Peter of Polymer Competence Center Leoben GmbH (PCCL)

Topic:

Dr. Peter Fuchs MBA

Polymeric materials play a decisive role in the performance and lifetime of modern microelectronic systems. From PCB or IC substrate laminates and encapsulation compounds to adhesives and functional layers, their thermo-hygro-mechanical behavior strongly influences stress evolution, warpage, delamination, and functional stability under service conditions. Modeling polymers in microelectronics, therefore, requires application-specific characterization combined with physics-based and multi-scale simulation approaches.

▸Based on advanced experimental methods, material models are calibrated to describe flow, curing, thermo-(hygro-)mechanical, and degradation behavior.
▸By linking global homogenized PCB models with detailed local sub-models, critical features can be assessed efficiently while maintaining computational feasibility.
▸Modeling polymers in microelectronics is a key enabler for physics-of-degradation understanding, reliability-driven design optimization, and the development of robust, next-generation electronic systems.

Biography:

Dr. Peter Fuchs MBA (male) studied Polymer Engineering and Science at the University of Leoben (Austria) and received his Master’s degree in 2007 and started working at the Polymer Competence Center Leoben GmbH (PCCL) as a researcher in the field of finite element simulation and fracture mechanics of polymers. He graduated to PhD in 2012. Research stays at the Case Western Reserve University, Cleveland, USA (functional polymers) and at the Imperial College London, UK (mechanical engineering) strengthened his multidisciplinary knowledge of material behavior and modeling of polymers. He additionally received an MBA degree in business administration in 2020. During his time at PCCL he established a research division in the field simulation and modeling of polymer and polymer composites. Heading the division he is responsible for a team of 15 researchers and a number of international and national research projects. He is the industry supervisor of five ongoing and five finished PhD thesis. Furthermore, he is the author of 51 peer reviewed publications (Scopus H-index of 9).

Address:Germany




Agenda

1. Introduction
2. Modeling Polymers in Microelectronics: From Material Behavior to System Reliability - Dr. Peter Fuchs MBA
3. Q&A Session. Moderators - Dr. Jakub Premyslaw Gromala / Dr. Alexandru Prisacaru


IEEE EPS Germany Chapter Webinar