IEEE Lecture - Next Generation Package Technology: How Will Organic Substrates Synergize with 2.5D?
As chiplet packaging proliferates, a reduction in die interconnect pitch and concomitant increase in escape routing density must be enabled to meet performance and cost targets. The traditional 2D solution (die on organic substrate) has limitations related to pitch and escape routing capability, which have promoted a shift to 2.5D technology (die + high density routing interface + organic substrate) in certain application spaces. Conventional thought is that use of a 2.5D solution can enable coarser, lower cost substrate design rules. However, a different cost point for 2D vs. 2.5D means that interconnect and escape routing should be properly balanced between the organic substrate and the high-density routing interface, to contain cost while delivering the proper level of chiplet integration. As both 2D and 2.5D solutions include an organic substrate, continuous development of higher routing density organic substrates is a prudent approach to enable cost-optimized solutions moving forward. This talk will cover current application space and limitations for 2D vs. 2.5D technology, and potential paths forward to achieve a cost-optimized, complementary solution.
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- 6455 Lusk Blvd
- San Diego, California
- United States 92121
- Building: Qualcomm Building Q Auditorium
- Starts 04 March 2026 08:00 AM UTC
- Ends 26 March 2026 07:00 AM UTC
- No Admission Charge
Speakers
Omar Bchir
Biography:
Omar Bchir is currently Vice President of Engineering on the Process and Package Solutions Team at Qualcomm. He has worked in the field of IC packaging for >20 years, first joining Intel Corporation in 2004 as a Substrate Pathfinding Engineer. In 2008, he moved to Qualcomm, where he remained for eight years, forming a substrate team and eventually leading the Advanced Packaging team. In 2016, Omar joined Rockley Photonics, focusing on design and proof of concept for next-generation Opto-ASIC network switches for mega data centers. In 2017, he joined Micron Technology, focusing on memory packaging development and optimization for automotive customers. In 2020, Omar joined Amazon's Project Kuiper, developing packages for terrestrial and space-based applications to support low-latency, high bandwidth satellite-based broadband internet access. Omar re-joined Qualcomm in 2023, and currently leads the Substrate Engineering, Automotive and Mobile Packaging teams.
Omar received a BS degree in chemical engineering from the Georgia Institute of Technology, and a Ph.D. degree in chemical engineering from the University of Florida. He holds 42 issued U.S. patents and has authored 13 publications.