Power Distribution in Heterogeneous Integrated Packaging for Data Center Computing
#vertical
#power
#delivery
#integrated
#voltage
#regulation
#thermal
#management
#heterogeneous
#integration
#2.5D
#3D
Join us for an insightful webinar with Francesco Carobolante, founder of IoTissimo® LLC and an EPS Distinguished Lecturer, as he explores the critical challenges and innovative solutions that advanced packaging can provide to address the "Power Wall". With over 30 years of industry experience and a tenure at Intel’s Corporate Strategy Office, Francesco will delve into the Heterogeneous Integration Roadmap (HIR) perspective on scaling high-power AI processors. This session will analyze how signal BW and energy requirements dictate the options available for architecting the package structure, including Vertical Power Delivery, integrated voltage regulators and advanced thermal management techniques. Discover how these architectural shifts are enabling the next generation of data center performance.
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- Starts
09 March 2026 07:00 AM UTC
- Ends
07 May 2026 07:00 PM UTC
- No Admission Charge
Speakers
Francesco Carobolante
Biography:
Francesco Carobolante is a Sr. Member of IEEE, Vice Chair of IEEE Northern Nevada Section, Co-chair of IEEE 5G Roadmap (now International Network Generations Roadmap) - Energy Efficiency Working Group, Member of IEEE Heterogeneous Integration Roadmap, Member of the Steering and Technical Committees for several IEEE PELS and PSMA initiatives (including PwrSoC and EnerHarv Workshops), and Principal at IoTissimo, where he helps global organizations and young companies develop technology and business strategies. He was previously Vice President Engineering at Qualcomm and Senior Director at Fairchild and STMicroelectronics.
Address:United States
