Dr. Adeel Bajwa of Kulicke and Soffa Industries

The rapid adoption of Artificial Intelligence (AI) and High Performance Computing (HPC) is driving unprecedented demand for ultra-high density, fine pitch interconnects, pushing Thermal Compression Bonding (TCB) technologies beyond current limits. Advanced packages increasingly feature hundreds of thousands to over a million interconnects, large die sizes (>26 × 34 mm), narrow inter chip spacing (≤50 µm), and reduced standoff heights (≤50 µm), making fluxless TCB processes essential. Today, formic acid (FA) vapor based fluxless TCB is the only technology widely deployed in mass production. However, concerns over FA related contaminants such as metal formates have motivated interest in Atmospheric Hydrogen Plasma (AHP) as an alternative oxide reduction method, given its primary by product is water vapor. Under certain conditions, plasma exposure to Sn  and In based interconnects can also generate volatile hydride species and associated contamination.

Biography:

Adeel received his M.Sc. and Ph.D. degrees in Microsystems Engineering from Albert-Ludwigs University of Freiburg, Germany, in 2012 and 2015 respectively. His PhD thesis focused on development and characterization of assembly techniques for GaN and SiC devices. In November 2015, he joined the Center for Heterogeneous Integration and Performance Scaling (CHIPS), Department of Electrical and Computer Engineering, UCLA, where he worked on the development of fine pitch interconnect techniques. Since November 2017, he is working for KnS in Advance Packaging Process R&D Department focusing on fluxless TCB u bonding techniques.

Address:United States