Electromigration Failure in Solder Joints in Advanced Packaging: Insights and Phase-Field-Based Mechanistic Modeling
This presentation introduces reliability-limiting mechanisms in lead-free solder joints used in advanced device packaging, including AI processors, where complex joint geometries endure extreme electrical and thermal loads. Escalating current densities are especially critical, as electromigration (EM) accelerates interfacial reactions, intermetallic compound (IMC) evolution, and void formation, destabilizing the joint while failure pathways in modern assemblies remain insufficiently understood. We establish a comprehensive metallurgical framework identifying microstructural drivers of EM-induced degradation and introduce a physics-based phase-field FEM model that captures IMC growth, void nucleation, and current-crowding effects. The simulations reproduce observed damage evolution, offering mechanistic insight and enabling more accurate long-term reliability prediction for next-generation high-power electronics.
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- 4353 Scorpius St
- Orlando, Florida
- United States 32816
- Building: Research 1
- Room Number: Room 101
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Co-hosted by the IEEE EPS Orlando Chapter and the UCF Department of Materials Science and Engineering.
For questions about this event, please contact Tengfei Jiang at tengfei.jiang@ucf.edu.
- Co-sponsored by UCF Department of Materials Science and Engineering
Speakers
Choong-Un Kim of The University of Texas at Arlington
Electromigration Failure in Solder Joints in Advanced Packaging
Biography:
Choong-Un Kim is Professor and Associate Chair of Materials Science and Engineering at The University of Texas at Arlington. He received his PhD from UC Berkeley and his BS and MS from Seoul National University. His research focuses on reliability failures in electronic devices, packages, and system assemblies, with emphasis on interface reactions, electromigration, dielectric breakdown, and corrosion-related degradation.
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| Seminar Flyer – Prof. Choong-Un Kim | Flyer for the IEEE EPS Orlando Chapter seminar by Prof. Choong-Un Kim on electromigration failure in solder joints in advanced packaging, co-hosted with the UCF Department of Materials Science and Engineering. | 5.59 MiB |