Failure Analysis of Engineering Materials for Advanced Electronic Packaging

#AI #advance #packaging #heterogeneous #integration #thermal #management #systems #data-centers #data-driven-modeling #artificial-intelligence, #glass #core #interposer #warpage
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Abstract In high-volume manufacturing, failures in advanced electronic packaging are an unavoidable reality. Consequently, effective failure analysis is vital for enhancing product quality, reliability, and safety. This multidisciplinary task requires the integration of fundamental material science with technological expertise in manufacturing processes and product operation. As packages incorporate increasingly diverse materials and complex geometries, the interactions between components become more intricate. To address this, a systematic, data-driven approach is essential for identifying root causes. This lecture outlines strategies for postulating and verifying failures by linking material properties and characterization techniques to specific failure modes. The session concludes by addressing the industry's most pressing technical challenges.

Outline

  1. Foundations of Failure Analysis: Global perspectives, packaging challenges, and the "Octagonal Relationship" of engineering materials.

  2. Mechanisms of Failure: Exploring electrical, thermal, mechanical, chemical, and optical properties in advanced packaging.

  3. Strategic Problem Solving: Implementing the 3C Technique (Create, Challenge, and Confirm) to navigate modern analysis hurdles.



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  • Binghamton University
  • 85 Murray Hill Road
  • Vestal, New York
  • United States 13850
  • Building: Center of Excellence Building
  • Room Number: Symposium Hall

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  • Co-sponsored by Benson Chan


  Speakers

KY Cheong of Universiti Sains Malaysia

Biography:

For over twenty-nine years, Professor Kuan Yew Cheong has been a passionate researcher, educator, trainer, consultant, and Professional Engineer specializing in materials science and engineering. He is a Full Professor at the School of Materials and Mineral Resources Engineering, Universiti Sains Malaysia (USM), Malaysia. Professor Cheong holds an extensive record of distinguished appointments, including: Commissioned Senior Scientist at the Korea Electrotechnology Research Institute (2004, 2006); Adjunct Associate Professor at Multimedia University, Malaysia (2012); Visiting Lecturer at Universiti Malaysia Perlis, Malaysia (2012); Visiting Professor at National Taiwan University (2018); Visiting Professor at MIMOS Semiconductor Sdn Bhd (2018); Technical Advisor for NTG Innovation Pte. Ltd., Singapore (Jan–Dec 2019); Affiliate of the Innovation Centre for Clean Water and Sustainable Energy (WISE), National Tsing Hua University, Taiwan (Nov 2018–Oct 2021); Editor of Materials Science in Semiconductor Processing (Elsevier, 2015–June 2021); Visiting Professor at the State Key Laboratory of Crystal Materials, Institute of Novel Semiconductor Materials, Shandong University, China (Jan 2022–Dec 2023); and External Examiner for Xiamen University Malaysia (New Energy Science and Engineering Program for Undergraduate, MSc, and PhD levels) (Feb 2025–Jan 2027) and for Monash University Malaysia [Bachelor of Materials Engineering (Honours)] (Feb 2026 – Jan 2027). Currently, Professor Cheong serves as: Technical Consultant (Failure Analysis) for MIMOS Services Sdn Bhd, Malaysia; Editor-in-Chief of Materials Science in Semiconductor Processing (Elsevier, since July 2021); Editor-in-Chief of the Journal of Minerals and Materials Engineering (USM, since March 2022); Editorial Advisory Board Member for the Elsevier Book Series "Vacuum and Thin Film Deposition Technologies" (since 15 April 2024); and Distinguished Lecturer of the IEEE Electronic Packaging Society, USA (1 January 2024–31 December 2027). His research focuses on solving environmental and energy challenges by designing and developing engineering materials ranging from soft bio-organic to extremely hard synthetic diamond for advanced solid-state device, electronic package, and module levels. This work has resulted in over 300 publications in high-impact journals, 6 reputable book chapters, 5 edited books, and 1 granted Malaysian Patent (MY-153033-A). His research philosophy featured in a documentary - “Stay Hungry Stay Foolish” - on a paid TV station, ASTRO AEC (Malaysia). Recognized as one of Stanford University's Top 2% Scientists for Citation Impact (Applied Physics, Materials) for 2022 to 2024, Professor Cheong is also a registered Professional Engineer with Practising Certificate (PEPC) (Board of Engineers, Malaysia), a "Top Research Scientist Malaysia (TRSM)" (Academy of Sciences Malaysia), and a Certified Professional Trainer accredited by The Human Resource Ministry, Malaysia (HRD Corp). He has delivered more than 500 technical training courses to multinational and local industries, resolving numerous challenging industrial cases related to electronic materials processing and reliability from wafer to module level. His professional affiliations include Fellow of The Institution of Engineers Malaysia (IEM), Senior Member of the Institute of Electrical and Electronics Engineers (IEEE), Distinguished Lecturer of the IEEE Electronic Packaging Society (EPS), Principal Interviewer for the IEM Professional Interview, Senior Evaluation Panel member for the Engineering Accreditation Council (Malaysia), and Founding Chairman of the IEM Material Engineering Technical Division.

Address:United States





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