PCB Material Characterization for Measurement-Simulation Correlation
This talk provides an overview of some prominent laminate material characterization techniques that are crucial for evaluating laminate permittivity and losses. These techniques are compared and contrasted with newer in-situ methodologies that excel at extracting parameters that yield highly accurate measurement-simulation correlation, highlighting where they excel and where they fall short.
The talk also demonstrates some common phenomena that can lead to dispersion in the measured time delay and effective dielectric constant, namely anomalous dispersion from discontinuities and non-TEM dispersion in microstrip structures.
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Speakers
Aditya Rao of Qualcomm
PCB Material Characterization for Measurement-Simulation Correlation
Biography:
Aditya Rao (Member, IEEE) received his B.Sc. degree from Manipal University, Manipal, KA, India, in 2019, and his M.S. and Ph.D. degrees from the High-Speed Digital Engineering Group at the University of Colorado Boulder, Boulder, CO, USA, in 2021 and 2024, respectively. His research has focused on electrically characterizing printed circuit boards using in-situ structures and on establishing broadband measurement-simulation correlation, with publications in the IEEE Transactions on Instrumentation and Measurement, the IEEE Transactions on SPI, the IEEE EMC+SIPI Symposium, IEEE Conference on EPEPS, and DesignCon.
He is currently a Senior Engineer in the Power and Signal Integrity Group (PSIG) at Qualcomm in San Diego, CA, USA.
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Agenda
Tuesday July 21
6pm Networking and Dinner
6:45pm Presentation
7:30 pm Q&A
8:00 End of Meeting
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