From Physics to Flash: An Industry Perspective on 3D NAND Technology, Reliability, and High-Performance SSDs

#device #flash-memory #memory #technology #AIcomputing #electrical-engineering
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IEEE YP Phoenix Chapter Semiconductor Seminar Series (SSS)


Three-dimensional NAND flash memory has become a cornerstone of modern data storage, powering everything from mobile devices to hyperscale data centers fueling the AI revolution. As the industry pushes toward both higher storage density through aggressive 
vertical scaling and faster operation to meet the demands of next-generation highperformance SSDs, low-latency AI/ML workloads, and real-time data-intensive applications, the challenges of maintaining robust device reliability grow increasingly complex. This talk provides an industry perspective on the co-evolution of 3D NAND density and performance, covering advances in cell architecture and scaling strategies alongside the reliability challenges that arise when optimizing for both capacity and speed. The presentation will also share practical insights on working as an engineer in the semiconductor memory industry and the career path from academia to industry, aimed at students and young professionals entering the field



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  • Starts 03 June 2026 07:00 AM UTC
  • Ends 14 August 2026 07:00 AM UTC
  • No Admission Charge


  Speakers

Zhongyuan John of Micron Technology

Topic:

From Physics to Flash: An Industry Perspective on 3D NAND Technology, Reliability, and High-Performance SSDs

Zhongyuan (John) Lu is a Principal Engineer in the NAND Cell Reliability group at Micron Technology in Boise, Idaho. Since joining Micron in 2017, he has worked on multiple generations of 3D NAND flash memory, focusing on cell device characterization, reliability assessment, and technology qualification. He has authored or co-authored 7 peer-reviewed journal papers, 20+ internal technical papers, and holds 20+ granted or filed U.S. patents. He has represented Micron at leading conferences including the IEEE IEDM and DRC.

John received his Ph.D. in Physics from the University of California, Berkeley in 2017, with M.S. degrees in Electrical Engineering and Physics from UC Berkeley, and a B.A.Sc. in Applied Physics from USTC. He is passionate about bridging the gap between academic research and industry practice for the next generation of engineers.

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