Long Island Chapter Technical Meeting & Dinner: Chiplet & Advanced Packaging Technologies
Overview:
This technical session, presented by Dr. John U. Knickerbocker, researcher from IBM, will provide a high-level overview of the latest developments in semiconductor and advanced packaging technologies, including chiplets, heterogeneous integration, wafer-scale packaging, co-packaged optics/photonics, thermal management, reliability testing, and advanced manufacturing processes. The presentation will explore how next-generation architectures, co-design methodologies, and advanced packaging innovations are accelerating system performance, improving energy efficiency, and enabling the transition from prototype development to high-volume manufacturing across the electronics industry.
- IBM Semiconductor & Advanced Packaging Research
- What’s next in Systems
- Applications & Research Ecosystem: Next Generation Innovations; Prototype to Volume Manufacturing
- Architecture, EDA and Co-Design
- Application form factor / Specifications: System Performance, Energy Efficiency, …
- Digital Simulations and Advanced Test Vehicle Co-Design / Product Design Kit – (PDK)
- Chiplets, Packaging, Components fabrication and Test
- Test Vehicle fabrication
- Component inspection and test
- Chiplet and Advanced Packaging Integration
- Test Vehicle Assembly / Integration
- Short loop iterations equipment / process development and characterization
- Modules, Wafer Scale Integration, Thermal Solutions, Co-Packaged Optics / Photonics and Characterization
- Power delivery, thermal solutions, electrical and optical interconnections, Integration Compatibility
- Module / Board level iterations equipment / assembly processes and characterization / Assembly Design Kit (ADK)
- Reliability, Test, Characterization and Qualifications
- Reliability Testing / Characterization; Failure Modes, corrective adjustments from components through integration
- Component through integration, Stress Test & Compatibility to Application level / JEDEC stress testing
- Summary
- Chiplet & Advanced Packaging can help accelerate new systems
- Innovations continue to support product differentiation, performance and energy efficiency
“IEEE Long Island section members are advised to attend this event at their personal choice and discretion and any fees or other expense paid by LI section members to attend this event will not be reimbursed by section or chapters of LI Section
Date and Time
Location
Hosts
Registration
-
Add Event to Calendar
- Radisson Hotel
- 110 Vanderbilt Motor Parkway
- Hauppauge, New York
- United States
- Contact Event Hosts
-
Thomas J Zanatta
TJZanatta@gmail.com
631-741-8455 - Co-sponsored by SMTA
Speakers
Dr. John U. Knickerbocker
IBM Research,
Thomas J. Watson Research Center,
1101 Kitchawan Road, Route 134,
Yorktown Heights, NY 10598
and
IBM Semiconductor Research Center,
257 Fuller Rd,
Albany, NY 12203
(knickerj@us.ibm.com).
He received his PhD degree in 1982 from the University of Illinois studying materials science & engineering. Dr. Knickerbocker is an IBM Distinguished Engineer and member of IBM Academy. He leads research programs in the Chiplet & Advanced Packaging Team at IBM and has over 40 years of experience between IBM Microelectronics and IBM Research. Dr. Knickerbocker has authored or co-authored over 300 patents / patent applications and more than 100 technical papers, presentations, and publications. He has over 18+ years of participation with the Packaging Technology Committee & ECTC.
Agenda
Agenda:
5:00 pm - Networking Reception (Open Bar)
6:15 pm - Dinner, Presentation to Follow
9:00 pm - Adjourn