Workforce Development for Six Sigma Manufacturing Capabilities of Legacy Packaging Technologies at OSATs and Advanced Packaging Technologies in the Future
We are pleased to invite you to an Industry Talk being organized by the IEEE IES Guwahati Chapter as part of the 3rd IEEE Guwahati Subsection Conference (GCON 2026).
Title: Workforce Development for Six Sigma Manufacturing Capabilities of Legacy Packaging Technologies at OSATs and Advanced Packaging Technologies in the Future
Speaker: Prof. Shankar Prasad
Professor of Practice, IIT Guwahati
Date: 4 June 2026 (Thursday)
Time: 3:00 PM – 4:00 PM
Venue: IEEE GCON 2026, IIT Guwahati
The talk will focus on the evolving semiconductor packaging ecosystem, highlighting workforce development strategies required for achieving Six Sigma manufacturing capabilities in legacy packaging technologies at OSATs (Outsourced Semiconductor Assembly and Test facilities), while also addressing the skills and competencies needed for emerging advanced packaging technologies.
This session will provide valuable insights for students, researchers, academicians, and industry professionals interested in semiconductor manufacturing, quality engineering, advanced packaging, and workforce readiness for the future of the electronics industry.
We cordially invite you to attend this informative session and interact with the speaker.
We look forward to your participation.
With regards,
IEEE IES Guwahati Chapter
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