Next Generation Microelectronics for Sensing & Communication Systems: Challenges and Opportunities for Innovations from Novel Materials, Devices & Circuits to Advanced Packaging & 3D Heterogenous Integration
#heterogeneous
#integration
#2.5D
#3D
#sensors
#advanced
#packaging
Microelectronics serve as the structural backbone for both global economic competitiveness and as our national defense strategy and forms the technical foundation for a wide array of applications. These include high-performance computing, artificial intelligence, autonomous systems, communications networks, and integrated sensing ecosystems. Next-generation microelectronic technologies are shifting away from traditional 2D silicon scaling by embracing 3D Heterogeneous Integration (3DHI), which vertically stacks and interconnects diverse materials. This leap enables unprecedented processing power, miniaturization, and energy efficiency crucial for advanced computing, sensing and communication systems.
This talk will focus on this grand vision as well as recent advances in the next-generation microelectronics and manufacturing for sensing and communication systems. It will highlight challenges and opportunities for innovations to address traditional physical scaling limits.
Date and Time
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Purdue University
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West Lafayette, Indiana
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United States
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Building:
WALC 2127
- Starts
18 June 2026 04:02 PM UTC
- Ends
13 July 2026 04:02 PM UTC
- No Admission Charge
Speakers
Hasan Sharifi of HRL Laboratories
Biography:
Hasan Sharifi is currently the Division Director for Sensing and Communication Systems, at HRL Laboratories, in Malibu, CA since 2009. He received his bachelor’s degree in 1994 and his PhD degree in 2007 in Electrical Engineering from Purdue University, West Lafayette. His research topics include design, fabrication and heterogeneous integration of advanced silicon and compound semiconductor materials, devices, and circuits for next generation sensing and communication systems. He has been principal investigator (PI) for various IRADs and U.S. government programs. Dr. Sharifi has published more than 90 journal and referred conference papers and holds more than 45 issued patents spans from RF/mm Wave to EO/IR applications. He has served as technical program committee chair for various IEEE conferences and is currently serving as a topic editor for IEEE Journal of Microwaves.
Address:Malibu, California, United States
