FastRC: Fast Resistance and Thermal Impedance Extraction Using Mesh-Based Modelling and Streaming Kron Reduction

#power-electronics #thermal-impedance #resistance #kron-reduction #mesh-based-modelling #modified-nodal-analysis #electro-thermal-modelling #pcb #busbars #semiconductor-packages #finite-element-analysis #memory #computational-complexity

This webinar introduces FastRC, a mesh-based modelling methodology for rapid extraction of electrical resistance and thermal impedance in three-dimensional conductors and thermal structures. The method discretises arbitrary geometries into regular mesh cells and formulates the equivalent electrical or thermal network using modified nodal analysis.

A streaming Kron reduction algorithm is then applied to eliminate internal nodes while preserving the behaviour at boundary and user-defined points of interest. This allows very large electrical and thermal problems to be solved with significantly reduced memory requirements.

The webinar will cover geometry discretisation, material assignment, network construction, boundary conditions, Kron reduction, and post-processing of voltage, current, temperature, and heat-flow distributions. Applications include PCB traces, power busbars, semiconductor packages, and package-level thermal models.

The session will also discuss accuracy, computational complexity, benchmarking examples, and practical considerations for using FastRC as a fast alternative between simplified lumped models and full finite-element analysis.

Speaker: Prof. Cheng Zhang

Affiliation: The University of Manchester, UK