The IEEE Electronics Packaging Society (EPS) San Diego Chapter, in partnership with San Diego State University (SDSU), is pleased to present a three-day summer school focused on the fundamentals and emerging trends in electronic packaging design and characterization.

The program is designed for senior undergraduate students, graduate students, recent graduates, and practicing engineers interested in advanced packaging technologies, heterogeneous integration, signal integrity, power integrity, thermal management, materials, package characterization, and electronic design automation.

The first two days will feature lectures from leading experts in industry and academia, followed by hands-on demonstrations and training sessions using advanced EDA and measurement tools provided by Keysight Technologies. The third day will include an industry site visit to Kyocera.

Topics Include

• Signal Integrity and S-Parameters
• Power Distribution Network (PDN) Measurement
• Electronic Packaging Materials
• Advanced Semiconductor Packaging
• Heterogeneous Integration
• Package Thermal Design
• Die-Package Co-Design
• 5G Beamformer Packaging
• Integrated Passives
• Package Characterization and Measurements
• Electronic Design Automation for Advanced Packaging