IEEE EPS Distinguished Lecture on Advanced Semiconductor Packaging
The IEEE Electronics Packaging Society (EPS) Chapter is pleased to invite you to a Distinguished Lecturer event featuring Dr. Dongkai Shangguan, IEEE Fellow, IMAPS Fellow, and internationally recognized expert in advanced electronics packaging and semiconductor manufacturing.
Lecture: Advanced Semiconductor Packaging: Technology Trends, Reliability and Thermal Management
The lecture will provide insights into emerging packaging technologies, reliability challenges, and thermal management solutions for next-generation semiconductor systems. The event will conclude with a networking apéro, offering an excellent opportunity to engage with researchers, students, and industry professionals and to establish new collaborations.
This event is sponsored in part by the IEEE EPS Society Distinguished Lecturer Program.
Date and Time
Location
Hosts
Registration
-
Add Event to Calendar
- Gloriastrasse 35
- Zurich, Switzerland
- Switzerland 8092
- Building: ETZ
- Room Number: ETZ E 81
- Click here for Map
- Starts 26 July 2026 10:00 PM UTC
- Ends 31 August 2026 10:00 PM UTC
- No Admission Charge
Speakers
Dongkai Shangguan
Advanced Semiconductor Packaging: Technology Trends, Reliability and Thermal Management
Biography:
Dr. Dongkai Shangguan, IEEE Fellow & IMAPS Fellow, is President of Thermal Engineering Associates Inc. (TEA), and a Strategic Advisor to innovative companies in the global semiconductor and electronics industry. Previously, he served as Corporate Vice President at Flex (formerly Flextronics) and as Chief Marketing Officer at STATSChipPAC (currently JCET). Early in his career, he held various technical and management responsibilities at Ford Electronics and Visteon.
Dr. Shangguan has published 3 books, authored/co-authored over 200 technical papers, and has been issued 32 U.S. patents.
Dr. Shangguan has served on the iNEMI Board of Directors, the IEEE EPS Board of Governors, and the IPC Board of Directors. He has received a number of recognitions for his contributions to the industry, including the Electronics Manufacturing Technology Award and the Outstanding Sustained Technical Contribution Award from IEEE EPS, the William D. Ashman Achievement Award from IMAPS, the President’s Award from IPC, and the Total Excellence in Electronics Manufacturing Award from the Society of Manufacturing Engineers.
Dr. Shangguan received his B.Sc. degree in Mechanical Engineering from Tsinghua University, China, MBA degree from San Jose State University, and Ph.D. in Materials from the University of Oxford, U.K. He conducted post-doctoral research at the University of Cambridge and The University of Alabama.