IMPACT Distinguished Lecture - Cu-Cu Hybrid Bonding for Chiplets Heterogeneous Integration
Cu-Cu hybrid bonding is one of the flip-chip Bumpless assembly technologies. The advantages of hybrid bonding are: (a) higher density, (b) finer pad pitch, (c) lower profile, and (d) better performance. In this lecture, some fundamentals and more than 21 high-volume manufacturing (HVM) or to be in HVM products and 12 new applications using hybrid bonding will be presented. In the next few years, we will see more implementations of Cu-Cu hybrid bonding, whether it is for performance, form factor, power consumption or cost. The content of this lecture is shown below.
Date and Time
Location
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- No. 1, Jingmao 2nd Rd.
- Nangang Dist.
- Taipei, T'ai-pei
- Taiwan
- Building: Taipei Nangang Exhibition Center, Hall 1 (TaiNEX 1)
- Room Number: Area L, 4F, TPCA Show Main Stage
- Click here for Map
- Starts 30 July 2026 04:00 PM UTC
- Ends 21 October 2026 04:00 PM UTC
- No Admission Charge
Speakers
Dr. John Lau
Co-Packaged Optics – 3D Heterogeneous Integration of Photonic IC and Electronic IC
Biography:
John H Lau, with more than 40 years of R&D and manufacturing experience in semiconductor packaging, has published more than 530 peer-reviewed papers (385 are the principal investigator), 52 issued and pending US patents (31 are the principal inventor), and 25 textbooks. John is an elected IEEE fellow, IMAPS Fellow, and ASME Fellow and has been actively participating in industry/academy/society meetings/conferences to contribute, learn, and share.
Agenda
- Introduction
- Origin of Hybrid Bonding
- Cu-Cu Hybrid Bonding Fundamentals
- 21 HVM or to be in HVM Products with Hybrid Bonding
- 12 New Applications with Hybrid Bonding
- Summary
- Potential R&D Topics in Hybrid Bonding