IEEE Lecture - The Future of High-Speed Interconnects: Challenges and Opportunities in Heterogeneous Integration
The transition from monolithic systems to chiplet-based heterogeneous integration is redefining the design of high-speed interconnects. This talk presents an overview of the key challenges associated with bandwidth scaling, signal integrity, power delivery, thermal management, and interconnect reliability in advanced packaging. It further discusses the impact of interconnect scaling, surface roughness, and emerging materials, including copper–graphene hybrid structures, on next-generation systems. Finally, the talk emphasizes the importance of electrical–thermal–mechanical co-design and multiphysics optimization in enabling future AI, HPC, and data-centric computing architectures. The schedule is as follows:
4-4.30 pm - Networking
4.30-6 pm - Lecture
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Speakers
Rohit Sharma
Biography:
Prof. Rohit Sharma is a Professor in the Department of Electrical Engineering at the Indian Institute of Technology (IIT) Ropar, India, where he leads the Nanoelectronics Research Group. His research focuses on high-speed interconnects, signal and power integrity, advanced packaging, heterogeneous integration, and AI-assisted design methodologies for next-generation electronic systems. He has authored over 100 technical publications, including two books, and has led several research projects of national importance in collaboration with government agencies and leading semiconductor industries. A Fellow of the IET, IETE, and IEI, and Senior Member of IEEE, Prof. Sharma has delivered numerous invited talks and tutorials at leading international IEEE conferences and actively serves the IEEE Electronics Packaging Society in various leadership roles.
Agenda
4-4.30 pm - Networking
4.30-6 pm - Lecture