Dine & Learn at CU Boulder: Advanced Packaging by Chris Fieldsend (Marvell Technology)
Abstract: The traditional computer system often had one silicon die attached to one package which was attached to the system’s motherboard. The package, which sits in the middle, helped translate the ultra-fine silicon connections to a more manageable density for the system’s motherboard. The need for faster processing and higher density systems has challenged this convention. Today’s package supports multiple processors and in many cases 8-12 additional memory silicon die. Electrically connecting all these die on one package has led to many thermal, mechanical and electrical challenges. In this presentation, Chris Fieldsend will outline how the industry got here and what solutions have been used in the past 5 years to deliver a major increase in speeds and density.
Students and professionals are welcome to attend. Registration is encouraged to help us plan attendance and communicate event updates.
Parking: Parking information at CU Boulder will be provided to event registrants closer to the event date.
** This event is part of the Front Range Speaker Series that brings together students, faculty, IEEE members, and engineering professionals for technical talks from experts across industry and academia. The speaker series is co-hosted by the IEEE University of Colorado Boulder Student Branch and the IEEE Denver Section. The series is open to all levels from technical beginners to experts.
Upcoming Talks:
- Thursday, October 8, 2026: "Chiplets - What / Why / Where" by Judd Gerber (Intel)
- Thursday, November 5, 2026:"Package and PCB Materials" by Darren Hitchcock (Panasonic)
- Thursday, December 3, 2026: Student presentations showcasing research and industry topics
Date and Time
Location
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- 1111 Engineering Drive
- Boulder, Colorado
- United States 80309
- Building: Engineering Center
- Room Number: ECCR 200
- Click here for Map
- Starts 24 August 2026 06:00 AM UTC
- Ends 10 September 2026 06:00 AM UTC
- No Admission Charge
Speakers
Marvell Technology
Biography:
Chris Fieldsend serves as Director, Advanced Packaging at Marvell Semiconductor in Burlington, VT, where he leads global engineering teams designing and validating advanced semiconductor packaging solutions for custom computing products, including XPU hardware, custom memory expanders, and leading-edge technology development vehicles. With over two decades of engineering and leadership in semiconductor test and characterization, load board and probe card development, and package design, Chris brings deep industry expertise across the entire semiconductor ecosystem. Prior to joining Marvell, he served as Senior Engineering Manager at IBM, responsible for test lab operations and hardware development, including worldwide wafer and module test hardware solutions for flagship enterprise microprocessors and quantum control modules. Chris is passionate about fostering growth in early career professionals, leading high energy and deeply talented teams, and holds a unique perspective on career progression in the semiconductor industry.
Agenda
Example Agenda
- 6:45–7:00 PM — Arrival and attendee check-in
- 7:00–7:10 PM — Welcome and speaker introduction
- 7:10–8:10 PM — Speaker presentation
- 8:10–8:20 PM — Q&A and discussion
- 8:20–8:30 PM — Closing remarks and upcoming speaker-series announcements