EMC Young Professionals Panel 2026
IEEE EMC SOCIETY GERMAN CHAPTER | YOUNG PROFESSIONALS
Careers, Consumer Technology & EMC Fundamentals — Straight from Industry and Academia
Join four EMC Young Professionals Ambassadors from industry and academia for an evening of talks, a live panel discussion, and audience Q&A — covering career paths in EMC, measurement science, consumer-device reliability, and grounding fundamentals. Open to students, young professionals, and anyone curious about how EMC shapes the technology we use every day.
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Speakers
Madhavi Dhara of Robert Bosch GmbH, Reutlingen, Germany
Designing a High-Impact Career in EMC
Brings an industry perspective on how EMC decisions shape consumer-facing technology, with practical guidance for building a successful career in the field.
Biography:
Lead EMC Expert
Simone Negri of Politecnico di Milano, Milan, Italy
Non-Intrusive Characterization Methods for Multiport Electrical Devices
Covers standards, theory, and advanced experimental characterization methods for modern electronic systems.
Biography:
Assistant Professor in the Dept. of Electronics, Information and Bioengineering
Niamat Hussain of University of Glasgow, Scotland, UK
From Drop-Damage to Radiation Risk: Rethinking Smartphone Case Engineering
Bridges academic research and deployable consumer-device technologies, with a focus on reliability and device protection.
Biography:
Lecturer (Assistant Professor) in Electronic and Nanoscale Engineering
Gaurav Mahajan of Apple Inc., Cupertino, CA, USA
Grounds for Grounding
Explores practical grounding concepts and EMC fundamentals, and how they impact performance and reliability in next-generation consumer devices.
Biography:
Module Camera EE Lead
Agenda
AGENDA
17:00 – 17:10: Welcome & Introduction – Dr.-Ing. Mathias Magdowski (Chair for Electromagnetic Compatibility, Otto von Guericke University Magdeburg, Germany)
17:10 – 17:25: Madhavi Dhara (Robert Bosch GmbH, Germany) – Designing a High-Impact Career in EMC
17:25 – 17:40: Simone Negri (Politecnico di Milano, Italy) – Non-Intrusive Characterization Methods for Multiport Electrical Devices
17:40 – 17:55: Niamat Hussain (University of Glasgow, UK) – From Drop-Damage to Radiation Risk: Rethinking Smartphone Case Engineering
17:55 – 18:10: Gaurav Mahajan (Apple Inc., USA) – Grounds for Grounding
18:10 – 18:40: Panel Discussion
18:40 – 18:55: Audience Q&A / Chat Box Questions
18:55 – 19:00: Closing Remarks
An activity of the IEEE EMC Society German Chapter – Young Professionals Program