Chemical and Physical Processes Enabling the Transition from 2/2.5D to 3/3.5D Packaging
A review will be presented on advanced packaging process engineering. The following topic will be reviewed: (1) The differences between 2/2.5D (side by side chips) and 3/3.5 D packaging (stacked chips) drive the need for hybrid bonding which in which the chips are stacked by bonding both insulator to insulator and Cu to Cu with zero gap. (2) Convention thermal compression bonding with Cu-solder-Cu bonds vs hybrid bonding with Cu-Cu and SiCN-SiCN bonds drives the need to control the surface chemistry on the nanoscale. (3) Hybrid bonding greatly improves thermal management and AI efficiency by removing heat transfer barriers and reducing interconnect distance. (4) Hybrid and fusion bonding (insulator-insulator) can be used for highly versatile heterogeneous integration for RF and silicon photonics. Recent work from the literature and the Kummel lab will be presented on new materials and processes for heat management and stress/warpage control. Finally, the potential for negative coefficient of thermal expansion (CTE) to control warpage in panel level packaging will be reviewed.
The schedule is as follows:
4-4.30 pm - Networking
4.30-6 pm - Lecture
Date and Time
Location
Hosts
Registration
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- 6455 Lusk Blvd
- San Diego, California
- United States 92121
- Building: Qualcomm Building Q Auditorium
- Starts 20 September 2026 07:00 AM UTC
- Ends 30 September 2026 09:00 PM UTC
- No Admission Charge
Speakers
Prof. Andrew Kummel
Biography:
Prof. Andrew Kummel received his undergraduate degree in Chemical Engineering from Yale University, his MS. Degree from Stanford in Chemical Engineering, and his PhD degree in chemistry Stanford University. He is currently a Distinguished Professor in the Department of Chemistry and BioChemistry at the UCSD. His group is focused on controlling chemistry on the nanoscale for heat spreaders, low-k dielectrics, quantum computer interconnects, subsurface cleans for hybrid bonding, and chiplet infill and underfill. His research has been supported recently by the SRC, Applied Materials, LAM, QoLabs, Samsung, TSMC, EMD, KLA Tencor, and Raytheon. His hobbies include being part of the of a national 30 faculty joint research project on interconnects and packaging, long distance running, and developing yoga chants for general chemistry.
Agenda
4-4.30 pm - Networking
4.30-6 pm - Lecture