Packaging the Future: Advanced Packaging and Chiplet Integration through ASU SHIELD USA
As semiconductor scaling faces increasing physical and economic challenges, advanced packaging and heterogeneous integration have become key enablers for next-generation AI, RF, high-performance computing, and wireless systems. In this talk, Sule Ozev, Professor at Arizona State University and Design Lead for SHIELD USA, will present the vision, progress, and future roadmap of the SHIELD USA program, a $100M national initiative focused on developing leap-ahead organic substrate technologies and strengthening U.S. leadership in advanced semiconductor packaging. The presentation will highlight key innovations demonstrated during Phase 1, including ultra-high-density planarized wiring, vertical interconnect blocks (VIBs), molded fan-out core technologies, adaptive defect mitigation, and advanced design enablement flows for large-scale chiplet integration. Attendees will also gain insight into emerging challenges and opportunities in package design, manufacturability, reliability, and system-level optimization for future heterogeneous systems. This seminar will provide a unique perspective on how advanced packaging technologies are enabling the next generation of AI, RF, and high-performance semiconductor products, while creating new opportunities for innovation across the semiconductor ecosystem.
The schedule is as follows:
4.30-5.30 pm PST - Lecture
Date and Time
Location
Hosts
Registration
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- 6455 Lusk Blvd
- San Diego, California
- United States 92121
- Building: Qualcomm Building Q Auditorium
- Starts 21 September 2026 09:00 PM UTC
- Ends 23 September 2026 11:00 PM UTC
- No Admission Charge
Speakers
Prof. Sule Ozev
Biography:
Professor Sule Ozev received her doctorate from University of California San Diego's Computer Science and Engineering Department in 2002. That same year, she joined Duke University's Electrical and Computer Engineering Department as an assistant professor. She worked on testing mixed-signal and radiofrequency circuits, built-in-self test techniques, analysis and mitigation of process variations, defect-tolerant microprocessor systems, and on-line, and off-line testing of microfluidic devices. In August 2008, she joined Arizona State University's Electrical Engineering Department (now School of Electrical, Computer and Energy Engineering) as an associate professor, continuing on the same line of research. She received National Science Foundation (NSF) CAREER award in 2006, and various other awards from NSF, SRC, NASA and IBM. She has published more than 100 conference and journal papers and holds one U.S. patent.
Agenda
4.30-5.30 pm PST - Lecture