From Chip to System: A Holistic Approach to 2D Scalable Low-Loss D-Band Active Phased Array Realization

#AP-S #integrated-circuits #phased #arrays #sensing #D #band #beam #steering # #silicon #communication #transmission #Antenna
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The relentless demand for multi-gigabit wireless communication and high-resolution sensing
drives rapid innovation in D-band (110–170 GHz) systems. However, realizing efficient and
scalable active phased arrays at these frequencies remains challenging due to high cost,
interconnect losses, packaging parasitics, and heterogeneous integration constraints. This
talk presents a holistic, system-level approach to low-loss D-band phased array integration
that unifies circuit, antenna, and packaging co-design. Leveraging both silicon-based
(CMOS, SiGe) and III–V integrated circuits, the approach emphasizes optimized
beamformer and power amplifier architectures combined with low-cost 2D scalable, wide-
angle scanning wideband antenna arrays implemented using low-cost PCB processes.
Through electromagnetic co-optimization and advanced interconnect engineering, the
framework achieves significant reduction in loss and improvement in overall system
efficiency. Measured D-band results from prototype modules demonstrate wide-angle beam
steering and data transmission rates up to 100 Gb/s. These results confirm the feasibility of
steerable, high-capacity arrays suitable for both communication and sensing platforms.



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  • 101 Crawfords Corner Road
  • Library meeting room
  • Holmdel, New Jersey
  • United States 07733
  • Building: Bell Works Building
  • Room Number: Meeting room with project - within library

  • Contact Event Hosts
  • Starts 25 September 2026 04:00 AM UTC
  • Ends 26 October 2026 10:30 PM UTC
  • No Admission Charge


  Speakers

Dr Kamil Kapusuz

Topic:

From Chip to System: A Holistic Approach to 2D Scalable Low-Loss D-Band Active Phased Array Realization

The relentless demand for multi-gigabit wireless communication and high-resolution sensing
drives rapid innovation in D-band (110–170 GHz) systems. However, realizing efficient and
scalable active phased arrays at these frequencies remains challenging due to high cost,
interconnect losses, packaging parasitics, and heterogeneous integration constraints. This
talk presents a holistic, system-level approach to low-loss D-band phased array integration
that unifies circuit, antenna, and packaging co-design. Leveraging both silicon-based
(CMOS, SiGe) and III–V integrated circuits, the approach emphasizes optimized
beamformer and power amplifier architectures combined with low-cost 2D scalable, wide-
angle scanning wideband antenna arrays implemented using low-cost PCB processes.
Through electromagnetic co-optimization and advanced interconnect engineering, the
framework achieves significant reduction in loss and improvement in overall system
efficiency. Measured D-band results from prototype modules demonstrate wide-angle beam
steering and data transmission rates up to 100 Gb/s. These results confirm the feasibility of
steerable, high-capacity arrays suitable for both communication and sensing platforms.

Biography:

Dr. Kamil Yavuz Kapusuz (Senior Member, IEEE) received the M.Sc. degree in Electrical
Engineering from Atilim University, Ankara, Turkey, in 2013, and the Ph.D. degree in
Electrical Engineering from the Electromagnetics Group, Department of Information
Technology, Ghent University, Ghent, Belgium, in 2021.
Since 2022, he has been a Senior Researcher in Electromagnetics at IMEC, Leuven,
Belgium, and since 2026, he has been a Professor at Ghent University, Ghent, Belgium.
From 2014 to 2016, he was a Senior Antenna Engineer at Remote Sensing Technologies,
Ankara, Turkey. From 2021 to 2022, he was a Visiting Scientist at the IETR Laboratory,
CNRS, Rennes, France. From 2021 to 2026, he was a Postdoctoral Fellow at Ghent
University, Ghent, Belgium. His research interests include the analysis and design of quasi-
optical systems, leaky-wave antennas, near-field focusing techniques, in-body and on-body
communication systems, active, reconfigurable, and unconventional millimeter-wave and
sub-terahertz phased arrays, as well as electromagnetic modeling and optimization of 2.5-D
and 3-D RF packaging architectures.
Dr. Kapusuz received the URSI Young Scientist Award at the 2021 URSI General Assembly.

Email:

Address:Ghent University, , Ghent, United States





Agenda

6:30pm Introduction of Speaker

6:35pm-7:20pm Presentation

7:20pm-7:40pm Q&A

7:40pm-7:45pm Closing

7:45pm-8:30pm Dinner