Dr. P M Raj of Florida International University

Wearable sensors co-packaged with sensor, signal mixer and telemetry components are developed to provide a multimodal cardiovascular monitoring platform with good signal sensitivity and data telemetry. In vitro phantom validation and benchmarking against current multimodal sensors have been used to demonstrate NIRS, ECG and SCG functionality. Wireless data transfer with near-field inductive link is developed and characterized. Low-frequency (40-200 kHz) telemetry with multiferroic transducers are also developed to enable efficient wireless power telemetry and sensor control through programmable static magnetic field generation. The system achieves robust power transmission at distances exceeding 3 cm by operating below 300 kHz, thereby minimizing tissue absorption, heat generation, and electromagnetic losses. The resulting patch can therefore function as a disposable, batteryless sensing layer with minimal embedded electronics. This architecture establishes a scalable path toward continuous low-burden cardiac monitoring with extremely low power operation and manufacturable flexible sensor integration.

Biography:

Dr. P. M. Raj‘s expertise is in packaging of electronic and bioelectronic systems, and component integration for power-supply, RF/mm-Wave and sensor telemetry functions. He is an is an Associate Professor with Biomedical Engineering and Electrical and Computer Engineering at Florida International University. He co-led several technical thrusts in electronic packaging, working with the whole electronic ecosystem, which includes semiconductor, packaging, material, tool, and end-user companies. His research led to >400 publications, which include 19 book chapters and 19 awarded patents. His work received more than 35 awards. He is an Associate Editor for IEEE CPMT transactions and IEEE Nanotechnology magazine, and the Co-Chair for the IEEE nanopackaging technical committee since 2014. He served/serves as the IEEE Distinguished Lecturer (Nanotechnology Council and Electronic Packaging Society).

Address:Florida International University, , Westchester, Florida, United States