[IEEE AP-S Seminar] Signal and Power Integrity in Chip Development

#signal-integrity #power-integrity #SerDes #AI-accelerators #CPU #Electronic-Design-Automation
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Please join us for an upcoming seminar by Dr. Rubaiyat Islam, AMD Fellow at Advanced Micro Devices (AMD).

 

Date: Wednesday, 21 October 2026

Time: 4 – 5 pm (ET)

Location: University of Toronto, Room UC 161, University College (Main Building), 15 King's College Circle, Toronto, ON M5S 3H7

 

This event is supported by the IEEE AP-S Technical Committee on Electromagnetics and Fundamentals (TC5) and the IEEE Toronto Section.

 

Abstract:

Electromagnetics and microwave circuit principles have long guided the art of designing substrates for packaging silicon chips. The chip package not only enables high-speed signals to propagate beyond the die but also delivers the power required for operation. With ever-increasing data rates and channel densities in SerDes and memory systems, along with the growing power demands of digital blocks in modern AI accelerators and CPUs, new package design challenges have emerged.

 

This presentation will introduce Signal and Power Integrity (SI/PI) analysis in chip design by outlining key technical challenges, solution methodologies, and software tool development at AMD. Today, SI/PI has evolved into a multidisciplinary field encompassing electromagnetics, circuit design, control systems, physical design, thermal and mechanical engineering, as well as manufacturing and yield optimization. This convergence of disciplines is driving innovation not only in design methodologies but also in Electronic Design Automation (EDA) software tools.

 

 

Biography:

Rubaiyat Islam received his BASc in Engineering Science in 2002 and his PhD in Electromagnetics in 2011 from the University of Toronto. In 2011, he joined Advanced Micro Devices (AMD) as a Senior Analog Design Engineer in the Signal Integrity Group. From 2020 to 2024, he served as a Principal Engineer at AMD, leading the development of multiple Signal and Power Integrity (SI/PI) Electronic Design Automation (EDA) software tools that are used in production workflows by both AMD internal teams and external customers. Currently, he is an AMD Fellow, with research and development interests in SI/PI for high-speed wireline communication systems, power delivery networks and voltage regulation, as well as electro-optical signal transmission.



  Date and Time

  Location

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  Registration



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  • 15 King's College Circle
  • Toronto, Ontario
  • Canada M5S 3H7
  • Building: University College (Main Building)
  • Room Number: UC 161

  • Contact Event Hosts
  • Starts 02 October 2026 04:00 AM UTC
  • Ends 21 October 2026 04:00 AM UTC
  • No Admission Charge


  Speakers

Rubaiyat Islam

Topic:

Signal and Power Integrity in Chip Development