This year's symposium places a special emphasis on AI challenges in Power Electronics and Packaging. We will be featuring distinguished plenary speakers: Kaladhar Radhakrishnan (Intel), Yi Zheng (Applied Materials), Cian Ó Mathúna (Tyndall National Institute), Madhavan Swaminathan (Penn State), Stephen Coates (Yuxuan Semi), and Rinkle Jain (NVIDIA), who will discuss topics including:

· Power delivery architectures for next-generation AI accelerators

· Vertical power delivery for AI computing and data centers

· Heterogeneous integration of Vertical power for AI

· AI-driven design, modeling, and optimization of power electronics

· Advanced packaging technologies for AI high-density power delivery

· Materials, thermal management, and reliability challenges for AI hardware

Whether your AI power challenges are for compute, power delivery networks, chiplet integration, advanced semiconductor packaging, thermal management, or next-generation power conversion, 3D-PEIM 2026 provides a unique forum to engage with the latest research and connect with leaders from academia and industry who are shaping the future of AI power solutions.