Heterogeneous Integration Technologies for AI System Scaling: Redefining Interconnects, Cooling and 3D Integration

#electronics-packaging #Advanced-Packaging #technology #Codesign #Heterogeneous #Integration #Cooling #Photonics #3d-integration
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The fields of advanced packaging and heterogeneous integration (APHI) have evolved at an unprecedented rate of innovation in recent years. This has been driven by two key driving factors: integrated circuit chiplets and AI compute needs. Together, these have driven the industry towards adopting package-level interconnect and bonding processes that are blurring the boundary between on-chip and off-chip interconnects, ever larger package substrates, 3D stacking, liquid cooling solutions, advanced power delivery architectures, and photonic I/Os. In this presentation, we will first review recent industry trends in APHI. Next, we will present our research in designing and fabricating passive-chiplets to build package functions that enable higher levels of integration density and performance, including cooling chiplets for 3D ICs that feature monolithic microfluidic cooling channels with high density through-silicon-vias, fiber-attach chiplets that self-align a bundle of fibers to a photonic integrated circuit at high precision, and mm-wave interconnect chiplets that provide broadband and low-loss connectivity for MMICs. Further, we will present advances in large area glass-core package substrates, including co-packaged optics. The schedule is as follows: 

4-4.30 pm - Networking

4.30-6 pm - Lecture


  Date and Time

  Location

  Hosts

  Registration


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  • 6455 Lusk Blvd
  • San Diego, California
  • United States 92121
  • Building: Qualcomm Building Q Auditorium
  • Contact Event Host
  • Starts 07 October 2026 07:00 AM UTC
  • Ends 20 October 2026 07:00 AM UTC
  • No Admission Charge

  Speakers

Prof. Muhannad Bakir

Biography:

Prof. Muhannad Bakir is the GlobalFoundries Termed Chair in Packaging and 3D Heterogeneous Integration Professor in the School of Electrical and Computer Engineering at Georgia Tech and the Director of the 3D Systems Packaging Research Center. His areas of interest include 2.5D and 3D heterogeneous integration technologies, photonic interconnects, and embedded cooling. Dr. Bakir and his research group have received more than thirty-five papers and presentation awards. Dr. Bakir is the recipient of the 2012 DARPA Young Faculty Award, 2013 Intel Early Career Faculty Honor Award, and the 2018 IEEE Electronics Packaging Society (EPS) Exceptional Technical Achievement Award “for contributions to 2.5D and 3D IC heterogeneous integration, with focus on interconnect technologies.”  In 2020, Dr. Bakir was the recipient of the Georgia Tech Outstanding Doctoral Thesis Advisor Award.




Agenda

4-4.30 pm - Networking

4.30-6 pm - Lecture