Third Annual IEEE Hybrid Bonding Symposium (HBS)
-- Enabling Hybrid Bonding Commercialization: performance, technology, materials, equipment, reliability ...
Hybrid Bonding has emerged as the technology of choice in the semiconductor industry for ultra-fine-pitch interconnection. With significant benefits for interconnect density and device performance, it will become widely adopted for a broad range of high-performance semiconductor devices in the years to come. The success of Hybrid Bonding technology for high-volume manufacturing depends critically on the process technology as well as materials and equipment. Design, performance characterization, thermal management and reliability are also important considerations to enable applications in various areas.
Join us to learn about this expanding field, and discover how it will affect heterogeneous integration and system design. Registration should start around November 1st.
Date and Time
Location
Hosts
Registration
-
Add Event to Calendar
Loading virtual attendance info...
- San Jose, California
- United States
- Contact Event Host
- Co-sponsored by Paul Wesling
- Starts 20 October 2026 07:00 AM UTC
- Ends 28 January 2027 08:00 AM UTC
- Admission fee ?