IEEE EPS - ESSCI SEMICONDUCTOR PACKAGING WORKSHOP 2026 - MRIIRS
IEEE-ESSCI SEMICONDUCTOR PACKAGING WORKSHOP 2026
Build Skills. Enable Innovation. Strengthen India's Semiconductor Ecosystem.
Organised by: IEEE Electronics Packaging Society (EPS) | Electronics Sector Skill Council of India (ESSCI)
Hosted at: Manav Rachna Educational Institutions, Faridabad, Delhi NCR
Dates: 16th, 17th & 18th November 2026
As India builds its semiconductor ecosystem, the demand for skilled talent in Assembly, Test, Marking & Packaging (ATMP) is growing rapidly. The IEEE Electronics Packaging Society (EPS) and the Electronics Sector Skill Council of India (ESSCI), in association with Manav Rachna Educational Institutions, are hosting a three-day workshop to help close this skills gap.
The program combines expert-led lectures, hands-on labs and real-world case studies. It gives participants practical, industry-relevant knowledge of semiconductor packaging, from fundamentals to the latest advances.
Workshop Highlights
- Advanced Packaging & Heterogeneous Integration
- Materials & Reliability
- Assembly & ATMP Manufacturing
- Design-Technology Co-Optimization (DTCO)
- Emerging Trends & Industry Landscape
Date and Time
Location
Hosts
Registration
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Add Event to Calendar
- Manav Rachna Institute Sector 42
- Faridabad, Haryana
- India 121010
- Building: I Block Auditorium (Basement)
- Click here for Map
Speakers
Dr Ashwini of CH11125 - Delhi Section Chapter,EP21
Biography:
Dr. Ashwini K. Aggarwal
Fellow- Institute of Electronics & Telecom Engineers,
IEEE Senior Member, Founder Chair, IEEE EPS Delhi chapter
Chair, Semiconductor Skill Committee, Electronics Sector Skill Council of India
Professor of Practice, Manav Rachna International Institute of Research & Studies
Dr. Ashwini (Ashwini) Aggarwal is a board member for Electronics Sector Skill Council of India & has chaired technical committees in Solar & Semiconductor domains. As a Subject Matter Expert for these domains at Electronics Sector Skill Council, he has contributed to the shaping of National Occupation Skill Standards in these domains. He is/has been the co-chair/Executive Committee member for key committees in IESA, ESSC, USISPF, CII, FICCI, ELCINA & IEEMA. – and lead contributor to the semiconductor & display domain policy inputs for the industry.
Post retiral from Applied Materials, Ashwini has been appointed as Advisor by HORIBA India (Japanese MNC) & LightSpeed Photonics, Singapore. He has also consulted for Organization for Economic Cooperation & Development & leading global entities in USA, Europe and Japan.
Ashwini has rich and diverse experience in handling the Enterprise and Government segment for the tech intensive ESDM sector. He retired on Aug 1’24 as the Director of Government Affairs at Applied Materials India. At Applied Materials, Ashwini handled government affairs which covered the public policy, programs, and market development initiatives relating to high-tech electronics including semiconductors, display, electronics and solar.
Dr Ashwini Aggarwal is currently Professor of Practice at Manav Rachna International Institute for Research Studies at Faridabad/Delhi NCR, an IEEE Senior Member, Founder Chair of the Delhi NCR Chapter of IEEE EPS (semiconductor packaging) & a Fellow of the Institute of Electronics and Telecom Engineers.
Ashwini is an industry veteran with 40+ years of experience including 18 years in Hewlett-Packard in several important and developmental roles. He has also worked with Omnicom Media Group, in their group company, CPM India, as Vice-President of Strategic initiatives. As Chairperson at IESA & ELCINA, he has handled a range of advocacy and ESDM industry development initiatives.
He is a B.Sc. (Hons) /M.Sc. in Physics and Electronics with distinction from St. Stephens College, MTech Electronics &Communications (VLSI & Semiconductors) and an MBA from FMS, University of Delhi. He earned his PhD from Aligarh Muslim University for his seminal work on rooftop solar markets in India.
Email:
Address:Sector - 9, , Faridabad, Haryana, India, 121010
Dr. Umesh
Biography:
Dr. Umesh Dutta is a PhD in the field of Electronics & Communication Engineering and is passionate about VLSI and Embedded Systems domain. He did his B.E. in Electronics and Communication Engineering from Manav Rachna College of Engineering (Affiliated to M.D.U Rohtak, during 2006-2010). He completed his masters with specialization in VLSI Design and Embedded Systems from Manav Rachna International Institute of Research and Studies (MRIIRS), Faridabad. He is currently working as the Director of Manav Rachna Innovation and Incubation Centre, Faridabad. He also holds the position of Associate Professor in the Department of Electronics & Communication Engineering at the School of Engineering & Technology, Manav Rachna International Institute of Research and Studies. His areas of interest include the Internet of Things (IoT), Robotics and Automation. He has almost 12 years of teaching experience during which he guided many UG and PG students in their project work.
He has contributed immensely as a mentor in the student projects which have been represented by Manav Rachna in various reputed national and international level project competitions like the Microsoft Imagine Cup. He has also authored six books on: ATMEGA168PB Micro-controller, MSP430G2553 LaunchPad, Arduino, 8051 Microcontroller, Raspberry Pi and IoT using Node MCU board. He also has a personal blog (umeshdutta.blogspot.com) which is very popular among Embedded enthusiasts and it acts as one of the channels through which he shares his ideas with the Embedded community. He has created various online courses on Arduino, Python, RPA and Web Development that are hosted on Udemy.
Email:
Address:MRIIRS, , Faridabad, Haryana, India, 121010
Dr. Rohin
Biography:
Dr. Rohin Y, is the CEO of LightSpeed Photonics and a technology entrepreneur focused on transforming how data moves inside next-generation computing systems. He is leading the development of opto-electronic interconnect technologies that deliver faster, more scalable, and energy-efficient performance for AI, high-performance computing, and data center infrastructure. With a background spanning physics, electronics, and distributed computing, Rohin brings together research excellence and real-world engineering execution. He holds over 20 patents and has authored multiple publications at leading international conferences in areas including embedded systems, advanced packaging, and near-package and co-packaged optics.
Email:
Address:Hyderabad, Telengana, India, 500001
CONTACT
Program Chair: aka.xli@outlook.com
General Queries: aggarwal.ambrish@outlook.com
Local Coordination: pratima.set@mriu.edu.in