"Introduction to Electronic & Microelectronic Packaging" course

#Packaging #BGU

A new course with a collaboration between IEEE EPS Israel and the dept. of mechanuck enguneering in Ben Gurion University. The agenda of the course includes subjects such as: system engineering, specs, enviromental conditions, adhesives, soldering, PCB, thermal management, dynamic design of electronic systems, FEA, screws and nuts, microelectronic packaging and more...