Addressing Performance and Reliability Concerns with Thermal Analysis for RF Power Applications

#MMIC #design #AWR #Thermal #Simulator,Microwave #Office #applications
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Electro-thermal simulation analysis is critical in the design and optimization of various electronic systems, such as power electronics, integrated circuits, and sensors. In electro-thermal simulation analysis, electrical and thermal models are integrated to simulate the behavior of the device under different operating conditions. The electrical model considers the device's electrical properties, while the thermal model considers the heat transfer mechanisms, such as conduction, convection, and radiation. The results of the simulation provide valuable insights into the device's performance, reliability, and safety. With the recent integration of the Cadence® Celsius™ Thermal Solver within the Cadence AWR Design Environment® platform, RF designers now have access to electro-thermal analysis for monolithic microwave IC (MMIC)/RFIC, PCB, and module designs. This discussion will highlight how the Celsius Thermal Solver directly uses design data such as layout geometries, material properties, and dissipated power simulation results from Microwave Office® to provide designers with thermal heat map visualization and operating temperature information critical to design success.


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  • Date: 11 May 2023
  • Time: 01:00 AM UTC to 03:00 AM UTC
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  • 501 Amapola Avenue
  • Torrance, California, California
  • United States 90501
  • Building: Conference Area
  • Contact Event Hosts
  • Starts 06 April 2023 12:35 AM UTC
  • Ends 10 May 2023 06:45 AM UTC
  • No Admission Charge

  Speakers

Dustin Hoekstra of AWR

Topic:

Addressing Performance and Reliability Concerns with Thermal Analysis for RF Power Applications

Dustin Hoekstra is an Application Engineer Architect supporting the AWR products at Cadence. He has been in the RF and Microwave industry for over 20 years, holding previous applications and design positions at GaAs and GaN semiconductor manufacturing companies Cree, Excelics, and Filtronic. Having been part of the AWR team since 2005, he currently supports many of Cadence’s top strategic customers. Mr. Hoekstra earned a bachelor’s degree in Electrical Engineering and Computer Sciences from the University of California at Berkeley.

Biography:

Dustin Hoekstra is an Application Engineer Architect supporting the AWR products at Cadence. He has been in the RF and Microwave industry for over 20 years, holding previous applications and design positions at GaAs and GaN semiconductor manufacturing companies Cree, Excelics, and Filtronic. Having been part of the AWR team since 2005, he currently supports many of Cadence’s top strategic customers. Mr. Hoekstra earned a bachelor’s degree in Electrical Engineering and Computer Sciences from the University of California at Berkeley.

Address:United States




Agenda

6:00 to 6:45 PM Social Mixer

6:45 PM Talk

7:45 Adjourn