IEEE Albuquerque SSCS/EDS Chapter Talk: Circuits and Technology Advancements for Resiliency and Reliability

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Circuits and Technology Advancements for Resiliency and Reliability (11/02 -- 4:10PM )
Next-generation SoCs for the Zetta-Scale computing era will be developed with increased integration of our compute, memory and communication systems in optimized advanced packaging solutions. The complexity of these systems is growing exponentially and the need to increase reliability while achieving high energy-efficiency is paramount. We will explore the challenges and opportunities in technology and circuits to enable resilient, reliable and secure circuits and systems. We will study several cases of advanced circuit design to address those growing challenges.

 

 

Presented by : Dr. Carlos Tokunaga

Carlos Tokunaga (IEEE S’98–M’08-SM’17) is a Senior Principal Engineer working in Technology and Circuit Pathfinding at Intel Corporation. Carlos received the B.S. degree in electronics engineering from the University of Los Andes, Bogotá, Colombia, in 2001, and the M.S. and Ph.D. degrees in electrical engineering from the University of Michigan, Ann Arbor, MI, USA, in 2005 and 2008, respectively. He is an IEEE Senior Member and served as a Member-at-Large in the IEEE SSCS Adcom in 2023-2025. He currently serves as the General Chair of CICC, and is a TPC member of ISSCC. He served in the VLSI Symposium TPC 2019-2024. He serves as an Associate Editor for the Open Journal of SSCS and is an SSCS Distinguished Lecturer 2025-2026. He received Intel Lab’s Gordon Moore Award in 2018. He has published over 55 technical papers in refereed conferences and journals and received over 20 patents.


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  • Starts 28 October 2026 06:00 AM UTC
  • Ends 02 November 2026 07:00 AM UTC
  • No Admission Charge

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Carlos

Topic:

Circuits and Technology Advancements for Resiliency and Reliability

Next-generation SoCs for the Zetta-Scale computing era will be developed with increased integration of our compute, memory and communication systems in optimized advanced packaging solutions. The complexity of these systems is growing exponentially and the need to increase reliability while achieving high energy-efficiency is paramount. We will explore the challenges and opportunities in technology and circuits to enable resilient, reliable and secure circuits and systems. We will study several cases of advanced circuit design to address those growing challenges.

Biography:

Carlos Tokunaga (IEEE S’98–M’08-SM’17) is a Senior Principal Engineer working in Technology and Circuit Pathfinding at Intel Corporation. Carlos received the B.S. degree in electronics engineering from the University of Los Andes, Bogotá, Colombia, in 2001, and the M.S. and Ph.D. degrees in electrical engineering from the University of Michigan, Ann Arbor, MI, USA, in 2005 and 2008, respectively. He is an IEEE Senior Member and served as a Member-at-Large in the IEEE SSCS Adcom in 2023-2025. He currently serves as the General Chair of CICC, and is a TPC member of ISSCC. He served in the VLSI Symposium TPC 2019-2024. He serves as an Associate Editor for the Open Journal of SSCS and is an SSCS Distinguished Lecturer 2025-2026. He received Intel Lab’s Gordon Moore Award in 2018. He has published over 55 technical papers in refereed conferences and journals and received over 20 patents.




Agenda

Circuits and Technology Advancements for Resiliency and Reliability (11/02 -- 4:10-5:00PM )

Q&A  with complimentary snacks/drinks (5:00-5:30PM )