PCB Fabrication Lab Tutorial

Share

The University of Windsor has recently procured several machines capable of fabricating dual layer PCBs complete with through-hole plating, solder mask, silk screen and solder paste deposition. The newly constructed PCB Fabrication lab s a valuable asset for engineering student clubs, capstone students, researchers and electrical hobbyists. This lab is located in CEI2205 and is available to all undergraduate engineering students free of charge.  

The purpose of this event is to introduce and familiarize all attendees with the PCB fabrication equipment to advance their circuit design and fabrication skillset. Drop by CEI2205 any time between 10:00am and 2:00pm to learn about this exciting new lab equipment. 



  Date and Time

  Location

  Hosts

  Registration



  • Date: 10 Jun 2022
  • Time: 10:00 AM to 02:00 PM
  • All times are (UTC-05:00) Eastern Time (US & Canada)
  • Add_To_Calendar_icon Add Event to Calendar
  • Windsor, Ontario
  • Canada

  • Co-sponsored by OACETT
  • Starts 22 May 2022 12:37 PM
  • Ends 10 June 2022 11:00 PM
  • All times are (UTC-05:00) Eastern Time (US & Canada)
  • No Admission Charge


  Speakers

Aya Abu-Libdeh Aya Abu-Libdeh

Biography:

I am a fourth-year Bachelor of Applied Science candidate studying Electrical and Computer Engineering at the University of Windsor and have completed minors in Mathematics and Business Administration. From 2019 to 2021, I have been a Research Assistant in the area of BioMEMS sensors in collaboration with the Electrical Micro & Nano Devices and Sensors (e-MINDS) research team at the University of Windsor and have since co-authored a textbook chapter titled “Sensors and Wearable Electronics in Healthcare” published in 2022.  

As a university student, I strive to make a positive and tangible impact on my community. I have been a teaching assistant developing labs on circuit analysis techniques for more than 350 undergraduate students and a tutor mentoring high school and undergraduate engineering students. I currently represent my peers in the ECE Department Council Appointments Committee, deliver workshops through IEEE CAS, and have built a new printed circuit board (PCB) fabrication lab with my colleagues to provide all students at the University of Windsor with highly coveted industry experience and resources needed for technical projects.

I have been awarded for my academic accomplishments, desire to do research for the benefit of others, community service, and demonstrated leadership. I plan on pursuing a Master’s in Electrical Engineering in the fall.

Dora Strelkova Dora Strelkova

Biography:

I’m a fourth-year Electrical Engineering student at the University of Windsor pursing a Bachelor of Applied Science with a completed minor in Mathematics and projected minor in Computer Science.  As an undergraduate researcher, I work in the Advanced Production and Design Lab where I focus on soft robotics, specifically the design of grippers for pick and place applications in automotive assembly line and greenhouse automation. I focus on end-effector design, implementing controls and sensor feedback to actuate said designs and realizing prototypes through additive manufacturing. My recent work explores the feasibility of integrating origami into robotics via 3D printed living hinges and compliant mechanism to design easily manufacturable and parametric grippers. I co-authored a conference paper on this work titled “Design and Fabrication of Novel Compliant Mechanisms and Origami Structures for Specialty Grippers” in late 2021. I presented my work on dimensional complaint living hinges at World Congress Experience held by SAE International in April, 2022. As a university student, I am active in the Engineering Student Society, recently completing my term as the VP Academic where I ran 3D printing design events, engineering competitions, provided cover letter and resume help and acted as the student to faculty liaison for academic concerns. I stay involved within the student community by sitting on the ECE Department Council Appointments Committee, delivering technical workshops through IEEE CAS and working alongside my colleagues to implement the university’s first PCB Fabrication Lab for undergraduates and graduates.