Nathan Blattau of Ansys

The reliability and manufacturability of BGA devices is becoming more dependent on the PCB structure, layout and chassis design. With every increasing part densities the chassis design (PCB mounting), board layout, and underfills can cause additional stresses to be applied to the BGA device beyond just the thermal expansion mismatch. This presentation will cover some of the thermal-mechanical issues, manufacturing defects, and modeling techniques that can be used to help determine the reliability of BGA devices.

Biography:

Dr. Nathan Blattau, Distinguished Engineer at Ansys, has been involved in the simulation and reliability of electronic equipment for over twenty years. Prior to joining Ansys, Dr. Blattau was the Vice President and Chief Scientist of DfR Solutions. He holds two patents and has authored over 20 papers and has presented on a wide variety of reliability issues within the electronics industry. His specialties include best practices in design for reliability, robustness of Pb-free, failure analysis, accelerated test plan development, nonlinear finite element analysis, and solder joint reliability. Dr. Blattau holds a Ph.D. in Mechanical Engineering, an M.S. in Mechanical Engineering, and a B.S. in Civil Engineering from the University of Maryland.